发明申请
- 专利标题: Curable Composition
- 专利标题(中): 可固化成分
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申请号: US11579405申请日: 2005-04-25
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公开(公告)号: US20080033087A1公开(公告)日: 2008-02-07
- 发明人: Toshihiko Okamoto , Masato Kusakabe
- 申请人: Toshihiko Okamoto , Masato Kusakabe
- 申请人地址: JP OSAKA
- 专利权人: KANEKA CORPORATION
- 当前专利权人: KANEKA CORPORATION
- 当前专利权人地址: JP OSAKA
- 优先权: JP2004-139110 20040507; JP2004-139111 20040507; JP2004-146972 20040517; JP2004-146973 20040517; JP2004-146974 20040517; JP2004-146976 20040517; JP2004-146977 20040517
- 国际申请: PCT/JP05/07800 WO 20050425
- 主分类号: C08J3/24
- IPC分类号: C08J3/24
摘要:
[Problem] There is provided a curable composition having high thixotropy and satisfactory curability by use of a non-organotin catalyst. [Means to Solve] A curable composition comprising (A) a polyoxyalkylene polymer having a silicon-containing group being capable of crosslinking by forming siloxane bonds and/or a (meth)acrylate polymer having a silicon-containing group being capable of crosslinking by forming siloxane bonds, (B) a titanium chelate, and (C) an amide wax type thixotropy-imparting agent.
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