Invention Application
- Patent Title: Curable Composition
- Patent Title (中): 可固化成分
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Application No.: US11579405Application Date: 2005-04-25
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Publication No.: US20080033087A1Publication Date: 2008-02-07
- Inventor: Toshihiko Okamoto , Masato Kusakabe
- Applicant: Toshihiko Okamoto , Masato Kusakabe
- Applicant Address: JP OSAKA
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP OSAKA
- Priority: JP2004-139110 20040507; JP2004-139111 20040507; JP2004-146972 20040517; JP2004-146973 20040517; JP2004-146974 20040517; JP2004-146976 20040517; JP2004-146977 20040517
- International Application: PCT/JP05/07800 WO 20050425
- Main IPC: C08J3/24
- IPC: C08J3/24

Abstract:
[Problem] There is provided a curable composition having high thixotropy and satisfactory curability by use of a non-organotin catalyst. [Means to Solve] A curable composition comprising (A) a polyoxyalkylene polymer having a silicon-containing group being capable of crosslinking by forming siloxane bonds and/or a (meth)acrylate polymer having a silicon-containing group being capable of crosslinking by forming siloxane bonds, (B) a titanium chelate, and (C) an amide wax type thixotropy-imparting agent.
Public/Granted literature
- US07763673B2 Curable composition containing a silicon-containing group polymer, a titanium chelate and an amide wax Public/Granted day:2010-07-27
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