Invention Application
US20080033087A1 Curable Composition 有权
可固化成分

  • Patent Title: Curable Composition
  • Patent Title (中): 可固化成分
  • Application No.: US11579405
    Application Date: 2005-04-25
  • Publication No.: US20080033087A1
    Publication Date: 2008-02-07
  • Inventor: Toshihiko OkamotoMasato Kusakabe
  • Applicant: Toshihiko OkamotoMasato Kusakabe
  • Applicant Address: JP OSAKA
  • Assignee: KANEKA CORPORATION
  • Current Assignee: KANEKA CORPORATION
  • Current Assignee Address: JP OSAKA
  • Priority: JP2004-139110 20040507; JP2004-139111 20040507; JP2004-146972 20040517; JP2004-146973 20040517; JP2004-146974 20040517; JP2004-146976 20040517; JP2004-146977 20040517
  • International Application: PCT/JP05/07800 WO 20050425
  • Main IPC: C08J3/24
  • IPC: C08J3/24
Curable Composition
Abstract:
[Problem] There is provided a curable composition having high thixotropy and satisfactory curability by use of a non-organotin catalyst. [Means to Solve] A curable composition comprising (A) a polyoxyalkylene polymer having a silicon-containing group being capable of crosslinking by forming siloxane bonds and/or a (meth)acrylate polymer having a silicon-containing group being capable of crosslinking by forming siloxane bonds, (B) a titanium chelate, and (C) an amide wax type thixotropy-imparting agent.
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