发明申请
- 专利标题： Multilayered printed wiring board and method for manufacturing the same
- 专利标题（中）： 多层印刷线路板及其制造方法
-
申请号： US11878660申请日： 2007-07-26
-
公开(公告)号： US20080047737A1公开(公告)日： 2008-02-28
- 发明人: Takahiro Sahara , Atsushi Kobayashi , Masahiko Igaue , Kiyoshi Takeuchi
- 申请人： Takahiro Sahara , Atsushi Kobayashi , Masahiko Igaue , Kiyoshi Takeuchi
- 专利权人： DAI NIPPON PRINTING CO., LTD.
- 当前专利权人： DAI NIPPON PRINTING CO., LTD.
- 优先权： JPP2006-205640 20060728
- 主分类号： H05K1/00
- IPC分类号： H05K1/00 ; H05K1/16 ; H05K3/36
摘要：
A multilayered printed wiring board includes a flexible wiring board with wiring layers on both main surfaces thereof; a rigid wiring board with wiring layers on both main surfaces thereof and formed opposite to the flexible wiring board under the condition that an area of the main surface of the rigid wiring board is smaller than an area of the main surface of the flexible wiring board; and an electric/electronic component embedded in the rigid wiring board.