发明申请
US20080054445A1 RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR AND ELECTRONIC SUB-SYSTEM PACKAGING
有权
用于半导体和电子子系统封装的芯片载体基板和印刷电路板上的刚体波形图案设计
- 专利标题： RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR AND ELECTRONIC SUB-SYSTEM PACKAGING
- 专利标题（中）： 用于半导体和电子子系统封装的芯片载体基板和印刷电路板上的刚体波形图案设计
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申请号： US11930816申请日： 2007-10-31
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公开(公告)号： US20080054445A1公开(公告)日： 2008-03-06
- 发明人: Chin-Tien Chiu , Chih-Chin Liao , Ken Wang , Han-Shiao Chen , Cheemen Yu , Hem Takiar
- 申请人： Chin-Tien Chiu , Chih-Chin Liao , Ken Wang , Han-Shiao Chen , Cheemen Yu , Hem Takiar
- 申请人地址： US CA Milpitas
- 专利权人： SANDISK CORPORATION
- 当前专利权人： SANDISK CORPORATION
- 当前专利权人地址： US CA Milpitas
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L21/00
摘要：
A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. When the substrate and dice are encased during the molding process, the rigid wave pattern effectively reduces deformation of and stresses on the dice, therefore substantially alleviating die cracking.
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