Invention Application
US20080055813A1 Electrostatic chuck, substrate processing apparatus having the same, and substrate processing method using the same
审中-公开
静电吸盘，具有该静电吸盘的基板处理装置以及使用其的基板处理方法
- Patent Title: Electrostatic chuck, substrate processing apparatus having the same, and substrate processing method using the same
- Patent Title (中): 静电吸盘，具有该静电吸盘的基板处理装置以及使用其的基板处理方法
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Application No.: US11892628Application Date: 2007-08-24
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Publication No.: US20080055813A1Publication Date: 2008-03-06
- Inventor: Hyoung-Kyu Son
- Applicant: Hyoung-Kyu Son
- Assignee: Advanced Display Process Engineering Co., Ltd.
- Current Assignee: Advanced Display Process Engineering Co., Ltd.
- Priority: KR10-2006-0083013 20060830
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67
Abstract:
An electrostatic chuck includes both a DC power supply and an AC power supply. DC power is supplied to an electrode of the chuck to generate an electrostatic holding force that holds a substrate on the chuck during substrate processing steps. When it is time to remove the substrate from the chuck, the DC power is cut off, and an AC power is applied to help eliminate any residual charge left on the chuck after the DC power has been cut off.
Information query
IPC分类:
