发明申请
US20080061042A1 LASER BEAM MACHINING SYSTEM 有权
激光束加工系统

  • 专利标题: LASER BEAM MACHINING SYSTEM
  • 专利标题(中): 激光束加工系统
  • 申请号: US11899452
    申请日: 2007-09-06
  • 公开(公告)号: US20080061042A1
    公开(公告)日: 2008-03-13
  • 发明人: Keiji Nomaru
  • 申请人: Keiji Nomaru
  • 申请人地址: JP Tokyo
  • 专利权人: Disco Corporation
  • 当前专利权人: Disco Corporation
  • 当前专利权人地址: JP Tokyo
  • 优先权: JP2006-247177 20060912
  • 主分类号: B23K26/38
  • IPC分类号: B23K26/38 B23K26/073
LASER BEAM MACHINING SYSTEM
摘要:
A laser beam machining system including a chuck table for holding a work, and a laser beam irradiation unit for irradiating the work held on the chuck table with a laser beam, wherein the laser beam irradiation unit includes: a pulsed laser beam oscillator for oscillating a pulsed laser beam; a condenser for condensing the pulsed laser beam oscillated from the pulsed laser beam oscillator; a laser beam scanning unit disposed between the pulsed laser beam oscillator and the condenser and operative to deflect the pulsed laser beam to be inputted to the condenser; and a laser beam reshaping unit which ids disposed between the pulsed laser beam oscillator and the laser beam scanning unit and by which the energy distribution of the pulsed laser beam oscillated from the pulsed laser beam oscillator is reshaped into a top hat shape.
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