发明申请
US20080061458A1 Mold for forming lens of light emitting diode package and method of manufacturing light emitting diode package using the same
审中-公开
用于形成发光二极管封装透镜的模具及使用其的制造发光二极管封装的方法
- 专利标题： Mold for forming lens of light emitting diode package and method of manufacturing light emitting diode package using the same
- 专利标题（中）： 用于形成发光二极管封装透镜的模具及使用其的制造发光二极管封装的方法
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申请号： US11896975申请日： 2007-09-07
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公开(公告)号： US20080061458A1公开(公告)日： 2008-03-13
- 发明人: Young Sam Park , Hun Joo Hahm , Seong Yeon Han , Chul Hee Yoo
- 申请人： Young Sam Park , Hun Joo Hahm , Seong Yeon Han , Chul Hee Yoo
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD
- 优先权： KR10-2006-0086261 20060907
- 主分类号： B29D11/00
- IPC分类号： B29D11/00 ; B28B7/36
摘要：
There is provided a mold formed of fluorocarbon resin to prevent a resin, which is a material of a lens of a LED package, from adhering to the mold even without using a separate release film, and a method of manufacturing the light emitting package using the mold. The mold includes a plurality of cavities formed in an upper surface thereof to hold a resin for forming lenses of the light emitting diode package. The mold and the method using the mold prevents adherence of the resin without using a separate release film, allowing formation of a lens with a smooth surface and formation of a protrusion or an indentation on the surface of the lens.