发明申请
- 专利标题： Adhesive tape cutting method and adhesive tape joining apparatus using the same
- 专利标题（中）： 胶带切割方法和使用其的胶带接合装置
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申请号： US11898831申请日： 2007-09-17
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公开(公告)号： US20080066869A1公开(公告)日： 2008-03-20
- 发明人: Masayuki Yamamoto , Saburo Miyamoto
- 申请人： Masayuki Yamamoto , Saburo Miyamoto
- 申请人地址： JP Ibaraki-shi
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JP Ibaraki-shi
- 优先权： JP2006-254256 20060920
- 主分类号： B32B41/00
- IPC分类号： B32B41/00
摘要：
In a state that a reference plane of a cutter holder, to which a cutter blade is attached, is brought into contact with a surface of a base of a supporting adhesive tape, the cutter blade cuts the supporting adhesive tape while the reference plane of the cutter holder follows the surface of the base. Herein, a cutting edge of the cutter blade passes by a joining interface between the supporting adhesive tape and a ring frame without penetrating through an adhesive layer of the supporting adhesive tape.
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