发明申请
US20080073108A1 SURFACE MOUNTING TYPE ELECTRONIC COMPONENTS AND MANUFACTURING METHOD OF THE SAME 审中-公开
表面安装型电子元件及其制造方法

  • 专利标题: SURFACE MOUNTING TYPE ELECTRONIC COMPONENTS AND MANUFACTURING METHOD OF THE SAME
  • 专利标题(中): 表面安装型电子元件及其制造方法
  • 申请号: US11861199
    申请日: 2007-09-25
  • 公开(公告)号: US20080073108A1
    公开(公告)日: 2008-03-27
  • 发明人: Kenji SaitoKohzo Yogiashi
  • 申请人: Kenji SaitoKohzo Yogiashi
  • 申请人地址: JP Tokyo 110-0005
  • 专利权人: Taiyo Yuden Co., Ltd.
  • 当前专利权人: Taiyo Yuden Co., Ltd.
  • 当前专利权人地址: JP Tokyo 110-0005
  • 优先权: JP2006-289225 20060926
  • 主分类号: H05K1/03
  • IPC分类号: H05K1/03 B05D5/12
SURFACE MOUNTING TYPE ELECTRONIC COMPONENTS AND MANUFACTURING METHOD OF THE SAME
摘要:
One inventive aspect relates to a surface mounting type electronic component excellent in a mounting property and having desired equivalent series resistance (ESR). The component has an electronic component body, and at least a pair of terminal electrodes formed on a surface of the electronic component body. The terminal electrode has a conductive resin layer formed between a substrate metal layer and a metal plating layer. The first and second layers each comprise a curable resin and metal particles. The first layer is lower in the content of metal particles than the second layer.
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