发明申请
- 专利标题: SURFACE MOUNTING TYPE ELECTRONIC COMPONENTS AND MANUFACTURING METHOD OF THE SAME
- 专利标题(中): 表面安装型电子元件及其制造方法
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申请号: US11861199申请日: 2007-09-25
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公开(公告)号: US20080073108A1公开(公告)日: 2008-03-27
- 发明人: Kenji Saito , Kohzo Yogiashi
- 申请人: Kenji Saito , Kohzo Yogiashi
- 申请人地址: JP Tokyo 110-0005
- 专利权人: Taiyo Yuden Co., Ltd.
- 当前专利权人: Taiyo Yuden Co., Ltd.
- 当前专利权人地址: JP Tokyo 110-0005
- 优先权: JP2006-289225 20060926
- 主分类号: H05K1/03
- IPC分类号: H05K1/03 ; B05D5/12
摘要:
One inventive aspect relates to a surface mounting type electronic component excellent in a mounting property and having desired equivalent series resistance (ESR). The component has an electronic component body, and at least a pair of terminal electrodes formed on a surface of the electronic component body. The terminal electrode has a conductive resin layer formed between a substrate metal layer and a metal plating layer. The first and second layers each comprise a curable resin and metal particles. The first layer is lower in the content of metal particles than the second layer.
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