公开(公告)号：US20080073108A1

公开(公告)日：2008-03-27

申请号：US11861199

申请日：2007-09-25

申请人： Kenji Saito ,  Kohzo Yogiashi

发明人： Kenji Saito ,  Kohzo Yogiashi

IPC分类号： H05K1/03 ,  B05D5/12

CPC分类号： H01G4/2325 ,  H01G4/005

摘要： One inventive aspect relates to a surface mounting type electronic component excellent in a mounting property and having desired equivalent series resistance (ESR). The component has an electronic component body, and at least a pair of terminal electrodes formed on a surface of the electronic component body. The terminal electrode has a conductive resin layer formed between a substrate metal layer and a metal plating layer. The first and second layers each comprise a curable resin and metal particles. The first layer is lower in the content of metal particles than the second layer.

摘要翻译： 本发明的一个方面涉及安装性能优异且具有期望的等效串联电阻（ESR）的表面安装型电子部件。 该部件具有电子部件主体，形成在电子部件主体的表面上的至少一对端子电极。 端子电极具有在基板金属层和金属镀层之间形成的导电性树脂层。 第一层和第二层各自包含可固化树脂和金属颗粒。 第一层的金属颗粒含量低于第二层。