发明申请
- 专利标题： Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same
- 专利标题（中）： 在其背面具有导热元件的微电子模具组件及其制造方法
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申请号： US11529851申请日： 2006-09-29
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公开(公告)号： US20080079125A1公开(公告)日： 2008-04-03
- 发明人: Daoqiang Lu , Chuan Hu , Dongming He
- 申请人： Daoqiang Lu , Chuan Hu , Dongming He
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A microelectronic die assembly. The die assembly includes a microelectronic die, and a thermally conductive element attached to the backside of the die with a thermal interface material. The thermally conductive element has lateral dimensions smaller than, substantially equal to, or larger than lateral dimensions of the die by up to a maximum amount, wherein the maximum amount is adapted to allow a mounting of the die assembly to a package substrate.
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