公开(公告)号：US20180170613A1

公开(公告)日：2018-06-21

申请号：US15385472

申请日：2016-12-20

申请人： Chris Hui Chuan Hu

发明人： Chris Hui Chuan Hu

IPC分类号： B65D17/00 ,  B65D43/16 ,  B65D51/24

CPC分类号： B65D17/4012 ,  B65D17/4011 ,  B65D43/164 ,  B65D47/10 ,  B65D51/247

摘要： A container is provided with a container body having an interior space and including an annular neck on a top, and a groove on an outer surface of the neck; and a base including a plurality of projections on a bottom edge, an internal space, an annular edge between a bottom of the internal space and an inner surface of the internal space, a seal on the bottom of the base and including a pull ring and a first release liner, and an aligning member on the bottom of the base. The pull ring includes a connection member attached to the first release liner. The connection member is protruded on both a top of a central portion of the pull ring and a bottom thereof. A substantial portion of the seal is surrounded by the pull ring, the first release liner and a second release liner.

公开(公告)号：US09741645B2

公开(公告)日：2017-08-22

申请号：US13995629

申请日：2011-12-21

申请人： Chuan Hu

发明人： Chuan Hu

IPC分类号： H01L23/02 ,  H01L23/498 ,  H01L21/768 ,  H01L23/00 ,  H01L23/538

CPC分类号： H01L23/49811 ,  H01L21/76885 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/11332 ,  H01L2224/11474 ,  H01L2224/1148 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/82 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/81

摘要： Dense interconnect with solder cap (DISC) formation with laser ablation and resulting semiconductor structures and packages are described. For example, a method of fabricating a semiconductor structure includes forming an insulative material stack above a plurality of solder bump landing pads. The solder bump landing pads are above an active side of a semiconductor die. A plurality of trenches is formed in the insulative material stack by laser ablation to expose a corresponding portion of each of the plurality of solder bump landing pads. A solder bump is formed in each of the plurality of trenches. A portion of the insulative material stack is then removed.

公开(公告)号：US20140240943A1

公开(公告)日：2014-08-28

申请号：US14269571

申请日：2014-05-05

申请人： Chuan Hu

发明人： Chuan Hu

IPC分类号： H05K1/02 ,  H05K1/11

CPC分类号： H05K1/0271 ,  B23K1/0018 ,  B23K1/203 ,  B23K3/0623 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05647 ,  H01L2224/10135 ,  H01L2224/10145 ,  H01L2224/11442 ,  H01L2224/11474 ,  H01L2224/1148 ,  H01L2224/11849 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/16238 ,  H01L2224/81139 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3841 ,  H05K1/11 ,  H05K13/0465 ,  H05K2201/10734 ,  Y10T428/12222 ,  H01L2924/00014 ,  H01L2924/00

摘要： An interconnection technology may use molded solder to define solder balls. A mask layer may be patterned to form cavities and solder paste deposited in the cavities. Upon heating, solder balls are formed. The cavity is defined by spaced walls to keep the solder ball from bridging during a bonding process. In some embodiments, the solder bumps connected to the solder balls may have facing surfaces which are larger than the facing surfaces of the solder ball.

摘要翻译： 互连技术可以使用模制焊料来限定焊球。 掩模层可以被图案化以形成沉积在空腔中的空腔和焊膏。 加热时，形成焊球。 空腔由间隔壁限定，以在焊接过程中保持焊球不起桥接作用。 在一些实施例中，连接到焊球的焊料凸块可以具有大于焊球的相对表面的相对表面。

公开(公告)号：US20130206820A1

公开(公告)日：2013-08-15

申请号：US13850581

申请日：2013-03-26

申请人： Chuan Hu

发明人： Chuan Hu

IPC分类号： H05K13/04 ,  H05K1/11

CPC分类号： H05K1/0271 ,  B23K1/0018 ,  B23K1/203 ,  B23K3/0623 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05647 ,  H01L2224/10135 ,  H01L2224/10145 ,  H01L2224/11442 ,  H01L2224/11474 ,  H01L2224/1148 ,  H01L2224/11849 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/16238 ,  H01L2224/81139 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3841 ,  H05K1/11 ,  H05K13/0465 ,  H05K2201/10734 ,  Y10T428/12222 ,  H01L2924/00014 ,  H01L2924/00

摘要： An interconnection technology may use molded solder to define solder balls. A mask layer may be patterned to form cavities and solder paste deposited in the cavities. Upon heating, solder balls are formed. The cavity is defined by spaced walls to keep the solder ball from bridging during a bonding process. In some embodiments, the solder bumps connected to the solder balls may have facing surfaces which are larger than the facing surfaces of the solder ball.

摘要翻译： 互连技术可以使用模制焊料来限定焊球。 掩模层可以被图案化以形成沉积在空腔中的空腔和焊膏。 加热时，形成焊球。 空腔由间隔壁限定，以在焊接过程中保持焊球不起桥接作用。 在一些实施例中，连接到焊球的焊料凸块可以具有大于焊球的相对表面的相对表面。

公开(公告)号：US07888183B2

公开(公告)日：2011-02-15

申请号：US12042392

申请日：2008-03-05

申请人： Cheng-Yi Liu ,  Johanna Swan ,  Steven Towle ,  Anna George, legal representative ,  Chuan Hu

发明人： Cheng-Yi Liu ,  Johanna Swan ,  Steven Towle ,  Chuan Hu

IPC分类号： H01L21/44

CPC分类号： H01L24/97 ,  H01L21/4871 ,  H01L23/142 ,  H01L23/36 ,  H01L23/367 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/19 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04105 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

摘要： A method and apparatus provide an integrated circuit package with improved heat dissipation and easier fabrication. The integrated circuit package includes a thinned semiconductor die attached to a heat spreader using a thermally conductive material. The thinned die reduces the thermal resistance of the die/heat spreader combination to improve heat extraction from the die as well as eliminating processing steps in fabrication. Additionally, the thinned die becomes more compliant as it takes on the thermal/mechanical properties of the heat spreader to reduce stress-induced cracking of the die.

摘要翻译： 一种方法和装置提供具有改进的散热和更容易制造的集成电路封装。 集成电路封装包括使用导热材料附着到散热器的薄化半导体管芯。 减薄的模头降低了模具/散热器组合的热阻，以改善从模具的热提取以及消除制造中的加工步骤。 此外，薄型模具变得更加柔顺，因为它承受散热器的热/机械性能，以减少模具的应力引起的开裂。

公开(公告)号：US20100154513A1

公开(公告)日：2010-06-24

申请号：US12345643

申请日：2008-12-29

申请人： Shin-In Lin ,  Chi-Hung Lin ,  Ming-Chuan Hu ,  Xiao-Yong Hsu

发明人： Shin-In Lin ,  Chi-Hung Lin ,  Ming-Chuan Hu ,  Xiao-Yong Hsu

IPC分类号： G01N15/08 ,  B01D46/00

CPC分类号： B01D46/42 ,  B01D2273/18 ,  B01D2279/51

摘要： A gas mixing apparatus including a chamber, a filter, a gas transmitting unit and a porous layer is provided. The chamber includes a gas inlet and a gas outlet. The filter, which has at least one opening, is disposed at the gas outlet of the chamber. An environmental gas outside the chamber is filtered and becomes a clean gas after flowing through the filter into the chamber. The gas transmitting unit is connected to the opening of the filter to transmit a gas to be mixed into the chamber through the opening. The porous layer is disposed at the gas outlet. The gas to be mixed is mixed with the clean gas and leaves the chamber through the porous layer.

摘要翻译： 提供了包括室，过滤器，气体传输单元和多孔层的气体混合设备。 该室包括气体入口和气体出口。 具有至少一个开口的过滤器设置在室的气体出口处。 在室外的环境气体被过滤，并且在流过过滤器进入室之后变成干净的气体。 气体传输单元连接到过滤器的开口，以通过开口将待混合的气体传送到室中。 多孔层设置在气体出口处。 要混合的气体与清洁气体混合，并通过多孔层离开室。

公开(公告)号：US20090183172A1

公开(公告)日：2009-07-16

申请号：US11972300

申请日：2008-01-10

申请人： Lo Chuan HU ,  Chia Yuan Huang ,  Ching Chun Kao

发明人： Lo Chuan HU ,  Chia Yuan Huang ,  Ching Chun Kao

IPC分类号： G06F9/44

CPC分类号： G06F8/00

摘要： This invention relates to a middleware bridge system, for bridging a kernel space module and a user space middleware having a user space interface, including: a kernel space bridge manager, for providing a kernel space interface to receive function call request from the kernel space module; an user space bridge manager, for bringing a function call relating to the function call request to the user space middleware through the user space interface, and receiving a return data from the user space middleware; wherein the architecture of the kernel space interface is the same with the architecture of the user space interface. The present invention further includes a middleware bridge method thereof.

摘要翻译： 本发明涉及一种用于桥接内核空间模块和具有用户空间接口的用户空间中间件的中间件桥接系统，包括：内核空间桥管理器，用于提供从内核空间模块接收功能调用请求的内核空间接口 ; 用户空间桥管理器，用于通过用户空间接口将与功能呼叫请求相关的功能调用带到用户空间中间件，以及从用户空间中间件接收返回数据; 其中，内核空间接口的架构与用户空间接口的体系结构相同。 本发明还包括其中间件桥接方法。

公开(公告)号：US07560640B2

公开(公告)日：2009-07-14

申请号：US10996195

申请日：2004-11-22

申请人： Chuan Hu ,  David S. Chau

发明人： Chuan Hu ,  David S. Chau

IPC分类号： H01L35/28

CPC分类号： H01L35/34 ,  H01L23/38 ,  H01L35/32 ,  H01L2924/0002 ,  H01L2924/00

摘要： Embodiments of the invention provide a thin film thermoelectric cooler. The cooler may have a high packing density that provides good cooling performance. The cooler may be formed by forming a first set of cooling elements, depositing a conformal insulating layer on the first set, then forming a second set of cooling elements between the first set of elements.

摘要翻译： 本发明的实施例提供一种薄膜热电冷却器。 冷却器可具有高填充密度，提供良好的冷却性能。 可以通过形成第一组冷却元件，在第一组上沉积保形绝缘层，然后在第一组元件之间形成第二组冷却元件来形成冷却器。

公开(公告)号：US20080096324A1

公开(公告)日：2008-04-24

申请号：US11957355

申请日：2007-12-14

申请人： Daoqiang LU ,  Chuan Hu

发明人： Daoqiang LU ,  Chuan Hu

IPC分类号： H01L21/58

CPC分类号： H01L24/83 ,  H01L23/3735 ,  H01L24/32 ,  H01L2224/04026 ,  H01L2224/29111 ,  H01L2224/32507 ,  H01L2224/83193 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/01028 ,  H01L2924/00014

摘要： Embodiments relate to electronic assemblies and methods for forming electronic assemblies. One method includes providing a die and a copper heat spreader that are to be coupled to one another through a thermal interface material. A layer of tin is formed on the copper heat spreader. The heat spreader and the die are clamped together with the tin positioned between the heat spreader and the die. The assembly is heated so that the tin melts and forms at least one intermetallic compound with copper from the heat spreader. The heat spreader is then coupled to the die through the intermetallic compound.

摘要翻译： 实施例涉及用于形成电子组件的电子组件和方法。 一种方法包括提供待通过热界面材料彼此耦合的管芯和铜散热器。 在铜散热器上形成一层锡。 散热器和模具与放置在散热器和模具之间的锡夹紧在一起。 加热组件使得锡从散热器中熔化并与铜形成至少一种金属间化合物。 然后通过金属间化合物将散热器耦合到管芯。

公开(公告)号：US20070217147A1

公开(公告)日：2007-09-20

申请号：US11749444

申请日：2007-05-16

申请人： Je-Young Chang ,  Ioan Sauciuc ,  Chuan Hu ,  Chia-Pin Chiu ,  Gregory Chrysler ,  Ravi Prasher ,  Rajiv Mongia ,  Himanshu Pokharna ,  Eric DiStefano

发明人： Je-Young Chang ,  Ioan Sauciuc ,  Chuan Hu ,  Chia-Pin Chiu ,  Gregory Chrysler ,  Ravi Prasher ,  Rajiv Mongia ,  Himanshu Pokharna ,  Eric DiStefano

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  F28F3/12 ,  F28F2260/02 ,  H01L2924/0002 ,  H01L2924/00

摘要： A microchannel structure has microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. At least one of the microchannels has a length extent and has a first section at a first location along the length extent and a second section at a second location along the length extent. The first section of the microchannel has a first aspect ratio and the second section is divided into at least two sub-channels. Each sub-channel has a respective second aspect ratio that is greater than the first aspect ratio.

摘要翻译： 微通道结构中形成有微通道。 微通道将输送冷却剂并靠近集成电路以将热量从集成电路传递到冷却剂。 微通道中的至少一个具有长度范围，并且具有沿着长度范围的第一位置处的第一部分和沿着长度范围的第二位置处的第二部分。 微通道的第一部分具有第一宽高比，第二部分被划分为至少两个子通道。 每个子通道具有大于第一宽高比的相应的第二宽高比。