发明申请
- 专利标题： ELECTRONIC DEVICES WITH ENHANCED HEAT SPREADING
- 专利标题（中）： 具有增强热传播的电子设备
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申请号： US11763630申请日： 2007-06-15
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公开(公告)号： US20080080142A1公开(公告)日： 2008-04-03
- 发明人: Nan-Cheng Chen , Chun-Wei Chang , Chao-Wei Tseng
- 申请人： Nan-Cheng Chen , Chun-Wei Chang , Chao-Wei Tseng
- 申请人地址： TW Hsin-Chu
- 专利权人： MEDIATEK INC.
- 当前专利权人： MEDIATEK INC.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
An electronic device with enhanced heat spread. A printed circuit board is disposed in a casing and includes a first metal ground layer, a second metal ground layer, and a metal connecting portion. The first metal ground layer is opposite the second metal ground layer. The metal connecting portion is connected between the first and second metal ground layers. The second metal ground layer is connected to the casing. A chip is electrically connected to the printed circuit board and includes a die and a heat-conducting portion connected to the die and soldered with the first metal ground layer. Heat generated by the chip is conducted to the casing through the heat-conducting portion, first metal ground layer, metal connecting portion, and second metal ground layer.
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