公开(公告)号：US20220371161A1

公开(公告)日：2022-11-24

申请号：US17352392

申请日：2021-06-21

Applicant: Chun-Wei Chang

Inventor： Chun-Wei Chang

IPC: B25B1/24 ,  B25B1/02 ,  B25B1/10

Abstract: A vice jaw deflecting structure, comprising a vice main body, a lead screw positioning seat, a lead screw, a first flexible jaw set and a second flexible jaw set; the guide slot of the vice main body has a bottom surface, a first side wall surface, and a second side wall surface; the first flexible jaw set and the second flexible jaw set have a slide, a jaw and a limiting component; the slide is configured with a limiting block protruding toward the jaw, the limiting block protrudes toward the lead screw positioning seat and is formed with a -shaped stop block having a curved top view; the jaw bottom surface has a first convex wall surface and a second convex wall surface matching and contacting the first side wall surface and the second side wall surface.

公开(公告)号：US20220371160A1

公开(公告)日：2022-11-24

申请号：US17336344

申请日：2021-06-02

Applicant: Chun-Wei Chang

Inventor： Chun-Wei Chang

IPC: B25B1/10 ,  B25B1/02

Abstract: A vice jaw quick demounting structure, comprising a vice main body, a lead screw positioning seat, a lead screw, and first and second jaw sets, characterized in that: the first and second jaw sets both have a slide, a jaw and a limiting component; the top wall of the slide is protruded to form a limiting block, one side of the slide is protruded to form a -shaped stop block, and the left and right side walls are both configured with first and second embedding slots; the jaw has a slide chamber, and its front and rear side inner walls are respectively provided with a -shaped containing groove, and the left and right side walls of the jaw are respectively configured with a through hole; the limiting component goes through the through hole and can slide between the first and second embedding slots.

公开(公告)号：US20130234668A1

公开(公告)日：2013-09-12

申请号：US13781781

申请日：2013-03-01

Applicant: Li-Feng Kuo ,  Pao-Shun Tseng ,  Chun-Wei Chang

Inventor： Li-Feng Kuo ,  Pao-Shun Tseng ,  Chun-Wei Chang

IPC: H02J7/00

CPC classification number: H02J7/0052 ,  G06F1/266

Abstract: A power supply method for an universal serial bus apparatus is provided. The USB apparatus includes an upstream port module and a plurality of downstream port modules. The power supply method comprises the following steps: setting a maximum charging port number for the downstream port modules according to the connection configuration between the upstream port module and a host, and the condition of power supply from an external power supply; detecting the coupling condition of the electronic apparatuses to the downstream port modules so as to customize a specific charging specification for one of the electronic apparatuses; respectively providing a plurality of power to the electronic apparatuses according to the specific charging specification and the maximum charging port number. Thus, the electronic apparatuses enable to be charged with maximum charging currents and operate normally under the USB specification without being affected.

Abstract translation: 提供了一种用于通用串行总线装置的电源方法。 USB装置包括上游端口模块和多个下游端口模块。 电源方法包括以下步骤：根据上游端口模块与主机之间的连接配置以及外部电源的供电条件，为下游端口模块设置最大充电端口号; 检测电子设备到下游端口模块的耦合状态，以定制一个电子设备的特定充电规格; 分别根据特定的充电规格和最大充电端口号向电子设备提供多个电力。 因此，电子设备能够以最大充电电流充电并且在USB规范下正常工作而不受影响。

公开(公告)号：US08531847B2

公开(公告)日：2013-09-10

申请号：US13189578

申请日：2011-07-25

Applicant: Chun-Wei Chang ,  Jui-Feng Hu ,  Ming-Ta Yu

Inventor： Chun-Wei Chang ,  Jui-Feng Hu ,  Ming-Ta Yu

IPC: H05K7/00

CPC classification number: G06F1/185 ,  H01R12/7029 ,  H05K7/1431

Abstract: A mounting apparatus for an expansion card includes a shaft fixed to the expansion card, and a rotary member rotatably mounted to the shaft. The rotary member includes a cam, an operation portion opposite to the cam, and a latching portion formed between the cam and the operation portion. When fitting the expansion card to an expansion socket, the operation portion is operated to rotate the rotary member about the shaft, and the latching portion is latched to the expansion socket. When disassembling the expansion card from the expansion socket, the cam is levered against a top of the expansion socket to lift out the expansion card, thereby disassembling the expansion card from the expansion socket.

Abstract translation: 用于扩展卡的安装装置包括固定到扩展卡的轴和可旋转地安装到轴的旋转构件。 旋转构件包括凸轮，与凸轮相对的操作部分和形成在凸轮和操作部分之间的闩锁部分。 当将扩展卡安装到扩展插座时，操作部分被操作以使旋转部件围绕轴旋转，并且闩锁部分被闩锁到扩展插座。 从扩展插座拆卸扩展卡时，将凸轮靠在扩展插座的顶部，以抬起扩展卡，从而将扩展卡从扩展插槽中拆下。

公开(公告)号：US20120162884A1

公开(公告)日：2012-06-28

申请号：US13189578

申请日：2011-07-25

Applicant: CHUN-WEI CHANG ,  JUI-FENG HU ,  MING-TA YU

Inventor： CHUN-WEI CHANG ,  JUI-FENG HU ,  MING-TA YU

IPC: H05K7/00

CPC classification number: G06F1/185 ,  H01R12/7029 ,  H05K7/1431

Abstract: A mounting apparatus for an expansion card includes a shaft fixed to the expansion card, and a rotary member rotatably mounted to the shaft. The rotary member includes a cam, an operation portion opposite to the cam, and a latching portion formed between the cam and the operation portion. When fitting the expansion card to an expansion socket, the operation portion is operated to rotate the rotary member about the shaft, and the latching portion is latched to the expansion socket. When disassembling the expansion card from the expansion socket, the cam is levered against a top of the expansion socket to lift out the expansion card, thereby disassembling the expansion card from the expansion socket.

Abstract translation: 用于扩展卡的安装装置包括固定到扩展卡的轴和可旋转地安装到轴的旋转构件。 旋转构件包括凸轮，与凸轮相对的操作部分和形成在凸轮和操作部分之间的闩锁部分。 当将扩展卡安装到扩展插座时，操作部分被操作以使旋转部件围绕轴旋转，并且闩锁部分被闩锁到扩展插座。 从扩展插座拆卸扩展卡时，将凸轮靠在扩展插座的顶部，以抬起扩展卡，从而将扩展卡从扩展插槽中拆下。

公开(公告)号：US20110157779A1

公开(公告)日：2011-06-30

申请号：US12649302

申请日：2009-12-29

Applicant: CHUN-WEI CHANG ,  JUI-FENG HU ,  CHANG-JU WU

Inventor： CHUN-WEI CHANG ,  JUI-FENG HU ,  CHANG-JU WU

IPC: H05K5/00

CPC classification number: H05K5/0221

Abstract: An electronic device includes a chassis, a cover on the chassis, a fixing member fixed on the cover and a handling member. A pair of latches are arranged on the chassis and each define a latching hole. The fixing member includes a substrate and a pair of side plates each defining a locking groove. A pair of catches extend upwards from the substrate and each define a locking groove. Cooperatively the locking groove and the latching groove forms a closed groove. The handling member includes a pivot received in the closed groove, and a pair of shafts in the guiding grooves. Firstly, the handling member rotates around the shafts to cause the pivot to engage with the latch, and then rotates into the aperture around the pivot to cause the shafts to move upwards to make the cover moving relative to the chassis to lock with the chassis.

Abstract translation: 电子设备包括底架，底盘上的盖子，固定在盖子上的固定构件和操作构件。 一对闩锁布置在底盘上，每个都锁定一个锁定孔。 固定构件包括基板和各自限定锁定槽的一对侧板。 一对卡扣从基板向上延伸，并且各自限定锁定槽。 合作地，锁定槽和锁定槽形成封闭的槽。 处理构件包括容纳在封闭槽中的枢轴和引导槽中的一对轴。 首先，处理构件围绕轴旋转以使枢轴与闩锁接合，然后旋转到枢轴周围的孔中，以使轴向上移动以使盖相对于底盘移动以与底盘锁定。

公开(公告)号：US20080080142A1

公开(公告)日：2008-04-03

申请号：US11763630

申请日：2007-06-15

Applicant: Nan-Cheng Chen ,  Chun-Wei Chang ,  Chao-Wei Tseng

Inventor： Nan-Cheng Chen ,  Chun-Wei Chang ,  Chao-Wei Tseng

IPC: H05K7/20

CPC classification number: H05K7/205 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0206 ,  H05K3/341 ,  H05K3/3452 ,  H05K2201/0715 ,  H05K2201/09054 ,  H05K2201/10303 ,  H05K2201/10477 ,  H05K2201/10727

Abstract: An electronic device with enhanced heat spread. A printed circuit board is disposed in a casing and includes a first metal ground layer, a second metal ground layer, and a metal connecting portion. The first metal ground layer is opposite the second metal ground layer. The metal connecting portion is connected between the first and second metal ground layers. The second metal ground layer is connected to the casing. A chip is electrically connected to the printed circuit board and includes a die and a heat-conducting portion connected to the die and soldered with the first metal ground layer. Heat generated by the chip is conducted to the casing through the heat-conducting portion, first metal ground layer, metal connecting portion, and second metal ground layer.

Abstract translation: 具有增强散热性的电子设备。 印刷电路板设置在壳体中，并且包括第一金属接地层，第二金属接地层和金属连接部分。 第一金属接地层与第二金属接地层相对。 金属连接部分连接在第一和第二金属接地层之间。 第二金属接地层连接到外壳。 芯片电连接到印刷电路板，并且包括模具和连接到模具并与第一金属接地层焊接的导热部分。 由芯片产生的热量通过导热部分，第一金属接地层，金属连接部分和第二金属接地层传导到壳体。

公开(公告)号：US20050267194A1

公开(公告)日：2005-12-01

申请号：US11195524

申请日：2005-08-01

Applicant: Hsing-Pang Hsieh ,  Jing-Ping Liou ,  Jang-Yang Chang ,  Chun-Wei Chang

Inventor： Hsing-Pang Hsieh ,  Jing-Ping Liou ,  Jang-Yang Chang ,  Chun-Wei Chang

IPC: A61K31/405 ,  C07D209/08 ,  C07D209/12 ,  C07D209/14 ,  C07D209/30 ,  C07D401/06 ,  C07D405/06 ,  C07D491/04 ,  A61K31/404 ,  C07D209/04 ,  C07D49/02

CPC classification number: C07D401/06 ,  A61K31/405 ,  C07D209/08 ,  C07D209/12 ,  C07D209/14 ,  C07D209/30 ,  C07D405/06 ,  C07D491/04

Abstract: Indole compounds of the formula: wherein L1, L2, R1, R2, Ra, Rb, Rc, Rd, and Re are defined herein. Also disclosed are methods of using of the indole compounds in inhibiting tubulin polymerization and treating cancer and other angiogenesis-related disorders.

Abstract translation: 下式的吲哚化合物：其中L 1，L 2，R 1，R 2，R SUB 其中R a，R b，R c，R d和R e e在本文中定义 。 还公开了使用吲哚化合物抑制微管蛋白聚合和治疗癌症和其它血管发生相关疾病的方法。

公开(公告)号：US20050267108A1

公开(公告)日：2005-12-01

申请号：US11195531

申请日：2005-08-01

Applicant: Hsing-Pang Hsieh ,  Jing-Ping Liou ,  Jang-Yang Chang ,  Chun-Wei Chang

Inventor： Hsing-Pang Hsieh ,  Jing-Ping Liou ,  Jang-Yang Chang ,  Chun-Wei Chang

IPC: A61K31/405 ,  C07D209/08 ,  C07D209/12 ,  C07D209/14 ,  C07D209/30 ,  C07D401/06 ,  C07D405/06 ,  C07D491/04 ,  A61K31/5377 ,  A61K31/404 ,  A61K31/4439 ,  A61K31/496

CPC classification number: A61K31/405 ,  C07D209/08 ,  C07D209/12 ,  C07D209/14 ,  C07D209/30 ,  C07D401/06 ,  C07D405/06 ,  C07D491/04

Abstract: This invention relates to methods of inhibiting tubulin polymerization and treating cancer and other angiogenesis-related disorders with indole compounds of the formula: wherein L1, L2, R1, R2, Ra, Rb, Rc, Rd, and Re are defined herein.

Abstract translation: 本发明涉及抑制微管蛋白聚合并用下式的吲哚化合物治疗癌症和其它血管生成相关病症的方法：其中L 1，L 2，R 2， R 1，R 2，R a，R b，R c，R b， 本文定义了本发明的化合物。

公开(公告)号：US06933316B2

公开(公告)日：2005-08-23

申请号：US10318337

申请日：2002-12-12

Applicant: Hsing-Pang Hsieh ,  Jing-Ping Liou ,  Jang-Yang Chang ,  Chun-Wei Chang

Inventor： Hsing-Pang Hsieh ,  Jing-Ping Liou ,  Jang-Yang Chang ,  Chun-Wei Chang

IPC: A61K31/405 ,  C07D209/08 ,  C07D209/12 ,  C07D209/14 ,  C07D209/30 ,  C07D401/06 ,  C07D405/06 ,  C07D491/04 ,  A61K31/404 ,  C07D209/04

CPC classification number: A61K31/405 ,  C07D209/08 ,  C07D209/12 ,  C07D209/14 ,  C07D209/30 ,  C07D401/06 ,  C07D405/06 ,  C07D491/04

Abstract: Indole compounds of the formula: wherein L1 is CO; L2 is a bond; R1 is aryl or heteroaryl; R2 is H, aryl, heteroaryl, halogen, nitro, nitroso, cyano, azide, isothionitro, OR, OC(O)R, OC(O)OR, OC(O)NRR′, SO2R, SO3R, SO2NRR′, SR, NRR′, NRSO2NR′R″, NRSO2R′, NRSO3R′, NRC(O)R′, NRC(O)NR′R″, NRC(O)OR′, NRC(N)NR′R″, C(O)OR, or C(O)NRR′; each of Ra, Rb, Rc, and Rd, independently, is R, halogen, nitro, nitroso, cyano, azide, isothionitro, OR, OC(O)R, OC(O)OR, OC(O)NRR′, SO2R, SO3R, SO2NRR′, SR, NRR′, NRSO2NR′R″, NRSO2R′, NRSO3R′, NRC(O)R′, NRC(O)NR′R″, NRC(O)OR′, NRC(N)NR′R″, C(O)R, C(O)OR, C(O)NRR′, or Rb and Rc, Ra and Rb, or Rc and Rd taken together are O(CH2)nO; and Rc is H, alkyl, alkenyl, alkynyl, cyclyl, heterocyclyl, halogen, nitro, nitroso, cyano, azide, isothionitro, OR, OC(O)R, OC(O)OR, OC(O)NRR′, SO2R, SO3R, SO2NRR′, SR, NRR′, NRSO2NR′R″, NRSO2R′, NRSO3R′, NRC(O)R′, NRC(O)NR′R″, NRC(O)OR′, NRC(N)NR′R″, C(O)R, C(O)OR, or C(O)NRR′; in which each of R, R′, and R″, independently, is H, alkyl, alkenyl, alkynyl, aryl, heteroaryl, cyclyl, or heterocyclyl; and n is 1, 2, 3, 4, or 5.