Invention Application
- Patent Title: METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Patent Title (中): 制造半导体集成电路器件的方法
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Application No.: US11866301Application Date: 2007-10-02
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Publication No.: US20080096295A1Publication Date: 2008-04-24
- Inventor: Akio HASEBE , Yasuhiro Motoyama , Yasunori Narizuka , Seigo Nakamura
- Applicant: Akio HASEBE , Yasuhiro Motoyama , Yasunori Narizuka , Seigo Nakamura
- Priority: JP2006-288642 20061024
- Main IPC: H01L21/66
- IPC: H01L21/66
Abstract:
A technique of manufacturing a semiconductor integrated circuit device is provided for reducing the possibility of attachment of foreign matter to a membrane probe when performing probe inspection using the membrane probe formed by the manufacturing technique. A pressing member for pressing a membrane sheet includes a pressing pin receiving portion relatively disposed above for receiving the tip of a pressing pin of the plunger in a recess, and a membrane sheet pressing portion relatively disposed below. The membrane sheet pressing portion in contact with the membrane sheet has the minimum plane size to enable pressing of the entire surface of one chip of interest to be subjected to the probe inspection.
Public/Granted literature
- US07537943B2 Method of manufacturing a semiconductor integrated circuit device Public/Granted day:2009-05-26
Information query
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