发明申请
- 专利标题： METALLIZATION LAYER STACK WITHOUT A TERMINAL ALUMINUM METAL LAYER
- 专利标题（中）： 金属层堆叠没有终端铝金属层
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申请号： US11752519申请日： 2007-05-23
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公开(公告)号： US20080099913A1公开(公告)日： 2008-05-01
- 发明人: Matthias Lehr , Frank Kuechenmeister , Lothar Lehmann , Marcel Wieland , Alexander Platz , Axel Walter , Gotthard Jungnickel
- 申请人： Matthias Lehr , Frank Kuechenmeister , Lothar Lehmann , Marcel Wieland , Alexander Platz , Axel Walter , Gotthard Jungnickel
- 优先权： DE102006051491.2 20061031
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/44
摘要：
By directly forming an underbump metallization layer on a contact region of the last metallization layer, the formation of any other terminal metals, such as aluminum and corresponding adhesion/barrier layers, may be avoided. Consequently, the thermal and electrical behavior of the resulting bump structure may be improved, while process complexity may be significantly reduced.
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