发明申请
- 专利标题： Material and method of manufacture of a solder joint with high thermal conductivity and high electrical conductivity
- 专利标题（中）： 具有高导热性和高导电性的焊点的材料和制造方法
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申请号： US11598062申请日： 2006-11-13
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公开(公告)号： US20080110531A1公开(公告)日： 2008-05-15
- 发明人: Richard K. Schmid , Jacobus C. Doesburg
- 申请人： Richard K. Schmid , Jacobus C. Doesburg
- 专利权人： Sulzer Metco (US), Inc.
- 当前专利权人： Sulzer Metco (US), Inc.
- 主分类号： B23K35/14
- IPC分类号： B23K35/14 ; B23K35/22
摘要：
The present invention provides a powder blend or composite powder that is fed into a kinetic spray device, accelerated towards a substrate or part in order to form a composite solder with thermal and electrical properties better than existing solder. The other advantages of building a solder layer in this manner include a low oxide content to improve subsequent solderability, excellent control of the deposition thickness, excellent control of the deposition chemistry and lastly, high speed of manufacture.
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