发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGE SYSTEM WITH HEAT SINK
- 专利标题（中）： 集成电路封装系统与散热
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申请号： US11558413申请日： 2006-11-09
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公开(公告)号： US20080111217A1公开(公告)日： 2008-05-15
- 发明人: Antonio B. Dimaano , Il Kwon Shim , Henry D. Bathan , Jeffrey D. Punzalan
- 申请人： Antonio B. Dimaano , Il Kwon Shim , Henry D. Bathan , Jeffrey D. Punzalan
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Ltd.
- 当前专利权人： STATS ChipPAC Ltd.
- 当前专利权人地址： SG Singapore
- 主分类号： H01L23/36
- IPC分类号： H01L23/36 ; H01L21/98
摘要：
An integrated circuit package system is provided including forming a paddle, forming a ring with a recess in the paddle, mounting a device in the recess, forming a slot in the ring, and mounting a heat sink in the slot over the device.
公开/授权文献
- US07479692B2 Integrated circuit package system with heat sink 公开/授权日：2009-01-20
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