发明申请
- 专利标题： Semiconductor device and method of manufacturing the same
- 专利标题（中）： 半导体装置及其制造方法
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申请号： US11978370申请日： 2007-10-29
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公开(公告)号： US20080111235A1公开(公告)日： 2008-05-15
- 发明人: Hyo-Jae Bang , Heui-Seog Kim , Dong-Chun Lee , Seong-Chan Han , Jung-Hyeon Kim
- 申请人： Hyo-Jae Bang , Heui-Seog Kim , Dong-Chun Lee , Seong-Chan Han , Jung-Hyeon Kim
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 优先权： KR10-2006-0110766 20061110
- 主分类号： H01L23/488
- IPC分类号： H01L23/488 ; H01L21/60
摘要：
A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.
公开/授权文献
- US07663219B2 Semiconductor device and method of manufacturing the same 公开/授权日：2010-02-16
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