发明申请
- 专利标题: Method of chip manufacturing
- 专利标题(中): 芯片制造方法
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申请号: US11599473申请日: 2006-11-15
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公开(公告)号: US20080113457A1公开(公告)日: 2008-05-15
- 发明人: Wen Tsay , Bao-Iai Hwang , David Y. Chang , Ling Huang
- 申请人: Wen Tsay , Bao-Iai Hwang , David Y. Chang , Ling Huang
- 专利权人: AirDio Wireless Inc.
- 当前专利权人: AirDio Wireless Inc.
- 主分类号: H01L21/66
- IPC分类号: H01L21/66
摘要:
A method of chip manufacturing, comprises of a design stage; a simulation stage; a foundry stage; a testing/packaging stage; a cutting stage; and a final coating stage. The present invention provides a method of chip testing comprises of disposing a substrate layer on a wafer having a plurality of chips; exposing a plurality of pads on the chips of the wafer; forming bumps on the pads of the chips of the wafer; performing tests from the bumps on the chips of the wafer. Alternatively, the present invention provides a method of chip testing comprises of disposing a substrate layer on a wafer having a plurality of chips; connecting a plurality of pads on the chips of the wafer to a plurality of corresponding pads on the substrate layer; planting bumps on the pads on the opposite side of the substrate layer; performing tests from the bumps on the substrate layer.
公开/授权文献
- US07476555B2 Method of chip manufacturing 公开/授权日:2009-01-13