发明申请
- 专利标题： Composition and method for damascene CMP
- 专利标题（中）： 大马士革CMP的组成和方法
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申请号： US11599199申请日： 2006-11-13
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公开(公告)号： US20080113589A1公开(公告)日： 2008-05-15
- 发明人: Paul Feeney , Sriram Anjur , Jeffrey Dysard
- 申请人： Paul Feeney , Sriram Anjur , Jeffrey Dysard
- 申请人地址： US IL Aurora
- 专利权人： Cabot Microelectronics Corporation
- 当前专利权人： Cabot Microelectronics Corporation
- 当前专利权人地址： US IL Aurora
- 主分类号： B24B29/02
- IPC分类号： B24B29/02 ; B24B7/00 ; C09K3/14
摘要：
The invention provides a method of chemically-mechanically polishing a substrate having at least one feature defined thereon, wherein the feature has at least one dimension with a size W, with a chemical-mechanical polishing composition. The polishing composition comprises particles of an abrasive wherein the particles have a mean particle diameter DM wherein the mean particle diameter of the particles satisfies the equation: DM>W. The invention further provides a method of preparing the chemical-mechanical polishing composition.
公开/授权文献
- US07837888B2 Composition and method for damascene CMP 公开/授权日：2010-11-23
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