发明申请
- 专利标题： Microelectromechanical devices and fabrication methods
- 专利标题（中）： 微机电装置及制造方法
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申请号： US11594525申请日： 2006-11-07
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公开(公告)号： US20080122020A1公开(公告)日： 2008-05-29
- 发明人: Matthias Metz , Zhiyu Pan , Brian Stark , Markus Ulm , Gary Yama
- 申请人： Matthias Metz , Zhiyu Pan , Brian Stark , Markus Ulm , Gary Yama
- 专利权人： Robert Bosch GmbH
- 当前专利权人： Robert Bosch GmbH
- 主分类号： H01L29/84
- IPC分类号： H01L29/84 ; H01L21/56
摘要：
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes location of a piezoelectric material as part of a semiconductor sensing structure. The semiconductor sensing structure, in conjunction with the piezoelectric material, can be used as a sensing device to provide an output signal associated with a sensed event.
公开/授权文献
- US07671515B2 Microelectromechanical devices and fabrication methods 公开/授权日：2010-03-02