- 专利标题: Semiconductor device
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申请号: US12003111申请日: 2007-12-20
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公开(公告)号: US20080135961A1公开(公告)日: 2008-06-12
- 发明人: Ryuji Yamabi , Hiroshi Yano
- 申请人: Ryuji Yamabi , Hiroshi Yano
- 申请人地址: JP Yamanashi
- 专利权人: EUDYNA DEVICES INC.
- 当前专利权人: EUDYNA DEVICES INC.
- 当前专利权人地址: JP Yamanashi
- 优先权: JP2005-379661 20051228
- 主分类号: H01L31/00
- IPC分类号: H01L31/00
摘要:
A semiconductor device has an electrode pad, a capacitor and a substrate. The substrate has a given area on which the electrode pad and the capacitor are arranged. The electrode pad and the capacitor are arranged on the substrate so that each of at least two sides of the capacitor and each of at least two sides of the electrode pad is adjacent to each other at a given interval. The capacitor has a connecting side that connects the two sides of the capacitor and faces to the electrode pad. Outside angles of the capacitor formed by the connecting side and the two sides of the capacitor are more than 90 degrees.
公开/授权文献
- US07692227B2 Semiconductor device having an electrode pad 公开/授权日:2010-04-06