发明申请
- 专利标题： Electronic component
- 专利标题（中）： 电子元器件
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申请号： US11635874申请日： 2006-12-08
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公开(公告)号： US20080135995A1公开(公告)日： 2008-06-12
- 发明人: Wu Hu Li , Heng Wan Hong
- 申请人： Wu Hu Li , Heng Wan Hong
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/44
摘要：
An electronic component is disclosed. In one embodiment, the electronic component includes a frame having a base layer, a first layer, a second layer including palladium placed on the first layer, and a third layer including gold placed on the second layer. A semiconductor chip is positioned on the frame.
公开/授权文献
- US08125060B2 Electronic component with layered frame 公开/授权日：2012-02-28
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