公开(公告)号：US20080135995A1

公开(公告)日：2008-06-12

申请号：US11635874

申请日：2006-12-08

申请人： Wu Hu Li ,  Heng Wan Hong

发明人： Wu Hu Li ,  Heng Wan Hong

IPC分类号： H01L23/495 ,  H01L21/44

CPC分类号： H01L23/49582 ,  H01L23/4952 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48744 ,  H01L2224/48764 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49505 ,  H01L2224/85207 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/20755 ,  H01L2924/2076 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electronic component is disclosed. In one embodiment, the electronic component includes a frame having a base layer, a first layer, a second layer including palladium placed on the first layer, and a third layer including gold placed on the second layer. A semiconductor chip is positioned on the frame.

摘要翻译： 公开了电子部件。 在一个实施例中，电子部件包括具有基底层，第一层，包括放置在第一层上的钯的第二层以及包含置于第二层上的金的第三层的框架。 半导体芯片位于框架上。

公开(公告)号：US08703544B2

公开(公告)日：2014-04-22

申请号：US13406919

申请日：2012-02-28

申请人： Wu Hu Li ,  Heng Wan Hong

发明人： Wu Hu Li ,  Heng Wan Hong

IPC分类号： H01L21/50

CPC分类号： H01L23/49582 ,  H01L23/4952 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48744 ,  H01L2224/48764 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49505 ,  H01L2224/85207 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/20755 ,  H01L2924/2076 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electronic component and method of making an electronic component is disclosed. In one embodiment, the electronic component includes a frame having a base layer, a first layer, a second layer including palladium placed on the first layer, and a third layer including gold placed on the second layer. A semiconductor chip is positioned on the frame.

摘要翻译： 公开了一种制造电子部件的电子部件和方法。 在一个实施例中，电子部件包括具有基底层，第一层，包括放置在第一层上的钯的第二层以及包含置于第二层上的金的第三层的框架。 半导体芯片位于框架上。

公开(公告)号：US08125060B2

公开(公告)日：2012-02-28

申请号：US11635874

申请日：2006-12-08

申请人： Wu Hu Li ,  Heng Wan Hong

发明人： Wu Hu Li ,  Heng Wan Hong

IPC分类号： H01L23/495

CPC分类号： H01L23/49582 ,  H01L23/4952 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48744 ,  H01L2224/48764 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49505 ,  H01L2224/85207 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/20755 ,  H01L2924/2076 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electronic component is disclosed. In one embodiment, the electronic component includes a frame having a base layer, a first layer, a second layer including palladium placed on the first layer, and a third layer including gold placed on the second layer. A semiconductor chip is positioned on the frame.

摘要翻译： 公开了电子部件。 在一个实施例中，电子部件包括具有基底层，第一层，包括放置在第一层上的钯的第二层以及包含置于第二层上的金的第三层的框架。 半导体芯片位于框架上。

公开(公告)号：US20120156832A1

公开(公告)日：2012-06-21

申请号：US13406919

申请日：2012-02-28

申请人： Wu Hu Li ,  Heng Wan Hong

发明人： Wu Hu Li ,  Heng Wan Hong

IPC分类号： H01L21/50

CPC分类号： H01L23/49582 ,  H01L23/4952 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48744 ,  H01L2224/48764 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49505 ,  H01L2224/85207 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/20755 ,  H01L2924/2076 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electronic component and method of making an electronic component is disclosed. In one embodiment, the electronic component includes a frame having a base layer, a first layer, a second layer including palladium placed on the first layer, and a third layer including gold placed on the second layer. A semiconductor chip is positioned on the frame.

摘要翻译： 公开了一种制造电子部件的电子部件和方法。 在一个实施例中，电子部件包括具有基底层，第一层，包括放置在第一层上的钯的第二层以及包含置于第二层上的金的第三层的框架。 半导体芯片位于框架上。

公开(公告)号：US20080128741A1

公开(公告)日：2008-06-05

申请号：US12026323

申请日：2008-02-05

申请人： Wu Hu Li ,  Mohamad Yazid Wagiman ,  Min Wee Low

发明人： Wu Hu Li ,  Mohamad Yazid Wagiman ,  Min Wee Low

IPC分类号： H01L33/00

CPC分类号： H01L23/49551 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A leadframe for a semiconductor package and a semiconductor package manufactured from such a leadframe including a plurality of connection leads supported in a frame. A die mounting plate is centrally located in the leadframe and is supported by a plurality of support leads with each support lead electrically connected to the die mounting pad and extending in a direction outwardly therefrom towards the frame. Each support lead is formed with a connection pad portion and a down set link portion. Each connection pad portion is spaced from the die mounting plate and is designed for connection to a conductive bonding ground wire from a semiconductor device mounted on the die mounting plate. Each down set link portion is electrically connected to the die mounting pad and is arranged to support the die mounting pad in a spaced arrangement from the connection leads. The connection pad portion and the down set link portion overlap, in the direction of extension of the support lead.

摘要翻译： 一种用于半导体封装的引线框架和由包括支撑在框架中的多个连接引线的引线框制造的半导体封装。 模具安装板位于引线框架的中心位置，并且由多个支撑引线支撑，每个支撑引线电连接到管芯安装焊盘，并沿其向外朝着框架延伸。 每个支撑引线形成有连接焊盘部分和下降连接部分。 每个连接焊盘部分与管芯安装板间隔开，并被设计用于连接到安装在管芯安装板上的半导体器件的导电接合接地线。 每个下降连接部分电连接到模具安装垫，并且被布置成以与连接引线隔开的布置支撑模具安装垫。 连接垫部和下降连杆部在支撑引线的延伸方向上重叠。

公开(公告)号：US07875968B2

公开(公告)日：2011-01-25

申请号：US12026323

申请日：2008-02-05

申请人： Wu Hu Li ,  Mohamad Yazid Wagiman ,  Min Wee Low

发明人： Wu Hu Li ,  Mohamad Yazid Wagiman ,  Min Wee Low

IPC分类号： H01L23/495 ,  H01L23/02 ,  H01L23/48

CPC分类号： H01L23/49551 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Leadframe for a semiconductor package and manufacturing from such leadframe including a plurality of connection leads supported in a frame. Die mounting plate is centrally located in the leadframe and is supported by a plurality of support leads which are electrically connected to the die mounting pad and extending in a direction outwardly therefrom towards the frame. Each support lead is formed with a connection pad portion and a down set link portion. Each connection pad portion is spaced from the die mounting plate and is connected to a conductive bonding ground wire from a semiconductor device mounted on the die mounting plate. Each down set link portion is electrically connected to the die mounting pad and supports the die mounting pad in a spaced arrangement from the connection leads. The connection pad portion and the down set link portion overlap, in the direction of extension of the support lead.

摘要翻译： 用于半导体封装的引线框，并且从这种引线框制造，包括支撑在框架中的多个连接引线。 模具安装板位于引线框架的中心位置，并且由多个支撑引线支撑，多个支撑引线电连接到管芯安装焊盘并沿其向外朝着框架延伸。 每个支撑引线形成有连接焊盘部分和下降连接部分。 每个连接焊盘部分与管芯安装板间隔开并且从安装在管芯安装板上的半导体器件连接到导电接合接地线。 每个下降连接部分电连接到管芯安装垫，并以与连接引线隔开的布置支撑管芯安装焊盘。 连接垫部和下降连杆部在支撑引线的延伸方向上重叠。