发明申请
- 专利标题： IMAGINE SENSOR PACKAGE AND FORMING METHOD OF THE SAME
- 专利标题（中）： 图像传感器包装及其形成方法
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申请号： US11608266申请日： 2006-12-08
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公开(公告)号： US20080136012A1公开(公告)日： 2008-06-12
- 发明人: Wen-Kun Yang , Jui-Hsien Chang
- 申请人： Wen-Kun Yang , Jui-Hsien Chang
- 专利权人： Advanced Chip Engineering Technology Inc.
- 当前专利权人： Advanced Chip Engineering Technology Inc.
- 主分类号： H01L23/04
- IPC分类号： H01L23/04
摘要：
An image sensor package comprises a substrate, a chip mounted over the substrate, A molding material is formed surrounding the chip to expose a micron lens area, wherein the molding material includes via structure passing there through. A protection layer is formed on the micro lens area to prevent the micro lens. A redistributed conductive layer is formed over the molding material to connect to a pad of the chip. Metal pads are formed on via structure as connecting points with PCB. A cover layer is formed over the substrate to isolate the metal pads.
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