发明申请
- 专利标题: Substrate Processing Method and Substrate Processing Apparatus
- 专利标题(中): 基板加工方法及基板加工装置
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申请号: US11885870申请日: 2006-03-06
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公开(公告)号: US20080138508A1公开(公告)日: 2008-06-12
- 发明人: Daisuke Takagi , Xinming Wang , Akira Owatari , Masanori Ishizaka , Akira Fukunaga
- 申请人: Daisuke Takagi , Xinming Wang , Akira Owatari , Masanori Ishizaka , Akira Fukunaga
- 优先权: JP2005-062831 20050307
- 国际申请: PCT/JP2006/304815 WO 20060306
- 主分类号: B05D5/12
- IPC分类号: B05D5/12 ; B05C3/02 ; C09D5/00
摘要:
A substrate processing method is useful for forming, by electroless plating, a protective film, such as a magnetic film, which covers exposed surfaces of embedded interconnects composed of an interconnect material, such as copper or silver, embedded in fine interconnect recesses provided in a surface of a substrate. The substrate processing method includes bringing a surface of a substrate into contact with a processing solution whose temperature is adjusted to not more than 15° C., thereby activating the surface, and bringing the activated surface of the substrate into contact with a plating solution, thereby forming a metal film on the surface.