发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGES, SYSTEMS, AND METHODS
- 专利标题（中）： 集成电路封装，系统和方法
-
申请号： US12039077申请日： 2008-02-28
-
公开(公告)号： US20080142962A1公开(公告)日： 2008-06-19
- 发明人: Brent S. Stone , Dustin P. Wood , Kaladhar Radhakrishnan
- 申请人： Brent S. Stone , Dustin P. Wood , Kaladhar Radhakrishnan
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L21/02
摘要：
An integrated circuit package includes a first capacitor supported by a surface of a substrate, and a second capacitor supported by the surface of the substrate. The first capacitor is within a die shadow region, and the second capacitor lies outside of the die shadow region.
公开/授权文献
- US07687905B2 Integrated circuit packages, systems, and methods 公开/授权日：2010-03-30
信息查询
IPC分类:
