An element-mounting substrate includes a ceramic substrate, an electrode layer formed on the substrate and a ceramic coating layer which is formed on a part of the electrode layer and has a thickness of 5 to 50 μm. A process for producing the element-mounting substrate includes the steps of forming an electrode precursor layer in the shape of a pattern of an electrode layer on a ceramic plate or a green sheet of a large diameter, forming a ceramic coating precursor layer on a part of the electrode precursor layer and then firing the resulting precursor. In this process, it is preferable to form the ceramic coating layer so as to cover the electrode layer on a predetermined cutting line of the firing product. According to the element-mounting substrate in which a part of the electrode layer is covered with a ceramic, a failure in mounting an element attributable to the thickness of the ceramic coating layer can be prevented when the element is mounted. In addition, peeling or cracking of the electrode layer caused by impact during dicing can be prevented.