发明申请
US20080150825A1 HIGH-IMPEDANCE SUBSTRATE, ANTENNA DEVICE AND MOBILE RADIO DEVICE
失效
高阻抗衬底，天线器件和移动无线电器件
- 专利标题： HIGH-IMPEDANCE SUBSTRATE, ANTENNA DEVICE AND MOBILE RADIO DEVICE
- 专利标题（中）： 高阻抗衬底，天线器件和移动无线电器件
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申请号： US11950525申请日： 2007-12-05
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公开(公告)号： US20080150825A1公开(公告)日： 2008-06-26
- 发明人: Makoto Higaki , Kazuhiro Inoue , Shuichi Sekine , Akihiro Tsujimura
- 申请人： Makoto Higaki , Kazuhiro Inoue , Shuichi Sekine , Akihiro Tsujimura
- 申请人地址： JP Tokyo
- 专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人地址： JP Tokyo
- 优先权： JP2006-348380 20061225
- 主分类号： H01Q1/50
- IPC分类号： H01Q1/50 ; H03H7/01
摘要：
There is provided with a high-impedance substrate including: a finite ground plane; a plurality of metal plates arranged at a predetermined height from the finite ground plane and in a matrix pattern such that respective faces thereof are approximately parallel to the finite ground plane; and a plurality of linear conductive elements configured to connect the plurality of metal plates to the finite ground plane and, wherein outer metal plates arranged at an outermost periphery among the plurality of metal plates are connected with the linear conductive elements at edges of the outer metal plates.
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