发明申请
- 专利标题: Method of Forming Dielectric Layer of Flash Memory Device
- 专利标题(中): 形成闪存器件介质层的方法
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申请号: US11954673申请日: 2007-12-12
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公开(公告)号: US20080160748A1公开(公告)日: 2008-07-03
- 发明人: Kwon Hong , Dong Ho Lee , Jae Mun Kim , Hee Soo Kim , Jae Hyoung Koo
- 申请人: Kwon Hong , Dong Ho Lee , Jae Mun Kim , Hee Soo Kim , Jae Hyoung Koo
- 申请人地址: KR Icheon-si
- 专利权人: HYNIX SEMICONDUCTOR INC.
- 当前专利权人: HYNIX SEMICONDUCTOR INC.
- 当前专利权人地址: KR Icheon-si
- 优先权: KR10-2007-00225 20070102
- 主分类号: H01L21/283
- IPC分类号: H01L21/283
摘要:
The present invention relates to a method of forming a dielectric layer of a flash memory device. In a process of forming a dielectric layer of a flash memory device, the dielectric layer may include a first oxide layer, a high dielectric layer, and a second oxide layer is formed. Accordingly, a leakage current characteristic and reliability of the flash memory device can be improved.
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