The present invention provides a fabrication method of a multi-chip stacking structure. The method includes steps of: stacking the first chips on the chip carrier in a step-like manner to form a first chip module; electrically connecting the first chip module to the chip carrier by a plurality of first bonding wires; stacking the second chips on the first chip module in step-like manner to form a second chip module, wherein a bottom chip of the second chip module is stacked on a top chip of the first chip module by an adhesive layer with the bottom chip deviated from the top chip horizontally in a direction toward the first bonding wires; and electrically connecting the bond pads of the second chip module to the chip carrier by a plurality of second bonding wires.