发明申请
- 专利标题: Method of manufacturing semiconductor device, method of manufacturing semiconductor substrate and semiconductor substrate
- 专利标题(中): 制造半导体器件的方法,制造半导体衬底和半导体衬底的方法
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申请号: US12068916申请日: 2008-02-13
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公开(公告)号: US20080191254A1公开(公告)日: 2008-08-14
- 发明人: Osamu Matsuura
- 申请人: Osamu Matsuura
- 申请人地址: JP Kawasaki-shi
- 专利权人: FUJITSU LIMITED
- 当前专利权人: FUJITSU LIMITED
- 当前专利权人地址: JP Kawasaki-shi
- 优先权: JP2007-033251 20070214
- 主分类号: H01L29/92
- IPC分类号: H01L29/92 ; H01L21/00
摘要:
A semiconductor substrate with an insulating film, a barrier layer containing a metal and formed over the insulating film in a region that includes a peripheral edge part of a semiconductor substrate, a capacitor lower electrode layer formed on the barrier layer and having an edge-cut on the peripheral edge part of the semiconductor substrate, an oxide layer formed on the barrier layer at the peripheral edge part where the barrier layer is not covered by the lower electrode layer, a ferroelectric layer formed on the lower electrode layer and the oxide layer, and a capacitor upper electrode layer formed over the ferroelectric layer.
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