Invention Application
- Patent Title: METHOD FOR MOUNTING ELECTRONIC-COMPONENT MODULE, METHOD FOR MANUFACTURING ELECTRONIC APPARATUS USING THE SAME, AND ELECTRONIC-COMPONENT MODULE
- Patent Title (中): 用于安装电子元件模块的方法，使用其制造电子设备的方法和电子组件模块
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Application No.: US12052087Application Date: 2008-03-20
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Publication No.: US20080192447A1Publication Date: 2008-08-14
- Inventor: Kunihiro KOYAMA , Muneyoshi YAMAMOTO , Takanori UEJIMA , Dai NAKAGAWA , Masaki KIMURA
- Applicant: Kunihiro KOYAMA , Muneyoshi YAMAMOTO , Takanori UEJIMA , Dai NAKAGAWA , Masaki KIMURA
- Applicant Address: JP Nagaockakyo-shi
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaockakyo-shi
- Priority: JP2005-276572 20050922
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K3/30
Abstract:
A suction surface member is provided on an electronic component module including an electronic component base plate and surface mount device mounted on the electronic component base plate in order to provide a suction surface at a location that is substantially at the same level as or higher than that of an upper end of a transistor that is the tallest surface mount device. The suction head adheres to the suction surface to hold the electronic component module and the electronic component module is mounted on a motherboard defining the target board. Then a treatment is performed to prevent a situation in which an upper end of the suction surface member is higher than the upper end of the tallest surface mount device mounted on the electronic component base plate.
Public/Granted literature
- US07650692B2 Method for mounting electronic-component module Public/Granted day:2010-01-26
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