摘要:
A suction surface member is provided on an electronic component module including an electronic component base plate and surface mount device mounted on the electronic component base plate in order to provide a suction surface at a location that is substantially at the same level as or higher than that of an upper end of a transistor that is the tallest surface mount device. The suction head adheres to the suction surface to hold the electronic component module and the electronic component module is mounted on a motherboard defining the target board. Then a treatment is performed to prevent a situation in which an upper end of the suction surface member is higher than the upper end of the tallest surface mount device mounted on the electronic component base plate.
摘要:
A suction surface member is provided on an electronic component module including an electronic component base plate and surface mount device mounted on the electronic component base plate in order to provide a suction surface at a location that is substantially at the same level as or higher than that of an upper end of a transistor that is the tallest surface mount device. The suction head adheres to the suction surface to hold the electronic component module and the electronic component module is mounted on a motherboard defining the target board. Then a treatment is performed to prevent a situation in which an upper end of the suction surface member is higher than the upper end of the tallest surface mount device mounted on the electronic component base plate.
摘要:
A high-frequency composite component for selectively switching a GSM-system signal path and a DCS-system signal path for a signal transmitted to or received from an antenna terminal by a diplexer. Transmission-side input terminals and reception-side balanced output terminals to be switched by high-frequency switches are included in the GSM and the DCS systems. Matching elements include inductors and capacitors that are inserted between the reception-side balanced output terminals and the output side of surface acoustic wave filters.
摘要:
A high-frequency switch module includes a switch IC. An impedance matching circuit is connected to the antenna port of the switch IC. The impedance matching circuit includes a high-pass filter and a low-pass filter. The high-pass filter is disposed on the side of the antenna port, and is a substantially L-shaped circuit including a capacitor and an inductor. The antenna port is connected to the ground by the inductor.
摘要:
A high frequency module includes RF terminal lands at a first layer that is a surface layer of a multilayer substrate on which RF terminal electrodes of a switch IC are mounted that are arranged in a line. Each of the RF terminal lands is electrically connected to one end of a lead electrode at a second layer via a via hole. Some of the lead electrodes extend from corresponding ones of the RF terminal lands in an outward direction away from a side of the switch IC. The remaining ones of the lead electrodes extend from corresponding ones of the RF terminal lands in an inward direction that is opposite to the outward direction.
摘要:
A high-frequency switch module includes an ESD device, a switch IC, and a SAW filter element that are mounted on the surface of a multilayer substrate. A ground-side land for the ESD device is connected to an external-connection ground electrode for the ESD device by via holes and plane electrode patterns. A ground connection land for the switch IC and a ground connection land for the SAW filter element are connected to a common inner ground electrode by via holes, and are connected to a common external-connection ground electrode by via holes and another common inner ground electrode.
摘要:
In a high-frequency module, a duplexer element and a matching element are mounted on a surface of a multilayer substrate. On a layer close to the surface, an individual-terminal-side wiring electrode connected to an individual terminal of the duplexer element is provided. On two layers below the layer close to the surface, first and second ground electrodes are respectively provided. On a layer below the layers on which the first and second ground electrodes are provided, a common-terminal-side wiring electrode connected to the common terminal of the duplexer element and one end of the matching element is provided. On a layer close to a bottom surface of the multilayer substrate, a third ground electrode connected to the other end of the matching element is provided.
摘要:
In a first high frequency switch, a current path and a current path are connected in parallel. When a positive voltage is applied to a control terminal, a current flows through a path passing through (Vc2)→(DL)→(DSL1)→(DDI)→(GSL2)→(DL) and a path passing through (Vc2)→(DR)→(DD2)→(DL). In a second high frequency switch, a current path and a current path are connected in parallel. When a positive voltage is applied to a control terminal, a current flows through a first path and a second path. Thus, the transmission signal is switched with a low control voltage and deterioration of insertion loss characteristics or harmonic distortion characteristics is prevented.
摘要:
A high-frequency switching module in which a high-frequency switch including a diode, which functions as a switching device, and a high-frequency filter including inductors and a capacitor are integrated with each other. The inductor defining a π-type high-frequency filter is connected directly and in series to the diode. By inserting the inductor, the cut-off frequency of a Chebyshev-type low-pass filter circuit produced when the diode is turned ON can be shifted to a lower frequency side, and also, the ripple can be suppressed to a small level.
摘要:
A composite high-frequency component includes a diplexer arranged to separate/combine transmission/reception signals in frequency bands of a plurality of communication systems, transmit/receive switches, filters, and a balanced-unbalanced reception signal switch, and a matching circuit. The balanced-unbalanced reception signal switch includes a reception signal switch and balanced-unbalanced filters. A stripline in the transmit/receive switch and a stripline in the reception signal switch are provided on the same layers, and the matching circuit including capacitors is arranged between the transmit/receive switch and the reception signal switch.