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1.发明申请METHOD FOR MOUNTING ELECTRONIC-COMPONENT MODULE, METHOD FOR MANUFACTURING ELECTRONIC APPARATUS USING THE SAME, AND ELECTRONIC-COMPONENT MODULE 审中-公开用于安装电子元件模块的方法，使用其制造电子设备的方法和电子组件模块公开(公告)号：US20100085722A1
公开(公告)日：2010-04-08
申请号：US12631970
申请日：2009-12-07
IPC分类号： H05K7/02
CPC分类号： H01L25/165 , H01L23/3121 , H01L24/16 , H01L25/50 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/01004 , H01L2924/16152 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H05K1/141 , H05K3/284 , H05K3/288 , H05K3/303 , H05K2201/0125 , H05K2203/0195 , H05K2203/082 , H05K2203/083 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49165 , Y10T428/24917 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A suction surface member is provided on an electronic component module including an electronic component base plate and surface mount device mounted on the electronic component base plate in order to provide a suction surface at a location that is substantially at the same level as or higher than that of an upper end of a transistor that is the tallest surface mount device. The suction head adheres to the suction surface to hold the electronic component module and the electronic component module is mounted on a motherboard defining the target board. Then a treatment is performed to prevent a situation in which an upper end of the suction surface member is higher than the upper end of the tallest surface mount device mounted on the electronic component base plate.
摘要翻译： 吸引面构件设置在电子部件模块上，该电子部件模块包括电子部件基板和安装在电子部件基板上的表面安装装置，以便在与基本上等于或高于 作为最高的表面安装器件的晶体管的上端。 吸头粘附到吸力表面以保持电子部件模块，电子部件模块安装在限定目标板的主板上。 然后进行处理以防止吸附表面构件的上端高于安装在电子部件基板上的最高表面安装装置的上端的情况。
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2.发明申请METHOD FOR MOUNTING ELECTRONIC-COMPONENT MODULE, METHOD FOR MANUFACTURING ELECTRONIC APPARATUS USING THE SAME, AND ELECTRONIC-COMPONENT MODULE 有权用于安装电子元件模块的方法，使用其制造电子设备的方法和电子组件模块公开(公告)号：US20080192447A1
公开(公告)日：2008-08-14
申请号：US12052087
申请日：2008-03-20
CPC分类号： H01L25/165 , H01L23/3121 , H01L24/16 , H01L25/50 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/01004 , H01L2924/16152 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H05K1/141 , H05K3/284 , H05K3/288 , H05K3/303 , H05K2201/0125 , H05K2203/0195 , H05K2203/082 , H05K2203/083 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49165 , Y10T428/24917 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A suction surface member is provided on an electronic component module including an electronic component base plate and surface mount device mounted on the electronic component base plate in order to provide a suction surface at a location that is substantially at the same level as or higher than that of an upper end of a transistor that is the tallest surface mount device. The suction head adheres to the suction surface to hold the electronic component module and the electronic component module is mounted on a motherboard defining the target board. Then a treatment is performed to prevent a situation in which an upper end of the suction surface member is higher than the upper end of the tallest surface mount device mounted on the electronic component base plate.
摘要翻译： 吸引面构件设置在电子部件模块上，该电子部件模块包括电子部件基板和安装在电子部件基板上的表面安装装置，以便在与基本上等于或高于 作为最高的表面安装器件的晶体管的上端。 吸头粘附到吸力表面以保持电子部件模块，电子部件模块安装在限定目标板的主板上。 然后进行处理以防止吸附表面构件的上端高于安装在电子部件基板上的最高表面安装装置的上端的情况。
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