利索-全球专利检索

  1. 登录
  2. 注册
发明申请
US20080197461A1 Apparatus for wire bonding and integrated circuit chip package 审中-公开
导线接合装置和集成电路芯片封装

Apparatus for wire bonding and integrated circuit chip package
摘要：
An apparatus for wire bonding and a capillary tool thereof are provided. An exemplary embodiment of a capillary tool capable of a wire bonding comprises a body having a first internal channel of a first diameter for accommodating a flow of a conductive wire. A compressible head is connected to the body, having a second internal channel of a second diameter for accommodating the flow of the conductive wire, wherein the first diameter is fixed and the second diameter is variable, the second diameter is not more than the first diameter and a diameter the conductive wire flowed through the compressible head is adjustable. An integrated circuit (IC) package is also provided.
摘要（中）：

提供一种用于引线接合的装置及其毛细管工具。 能够引线接合的毛细管工具的示例性实施例包括具有用于容纳导线流动的第一直径的第一内部通道的主体。 可压缩头连接到主体，具有用于容纳导线流动的第二直径的第二内部通道，其中第一直径是固定的，第二直径是可变的，第二直径不大于第一直径 并且流过可压缩头的导线的直径是可调节的。 还提供集成电路（IC）封装。

信息查询
Global Dossier Espacenet
0/0