发明申请
US20080197461A1 Apparatus for wire bonding and integrated circuit chip package
审中-公开
导线接合装置和集成电路芯片封装
- 专利标题： Apparatus for wire bonding and integrated circuit chip package
- 专利标题（中）： 导线接合装置和集成电路芯片封装
-
申请号： US11706193申请日： 2007-02-15
-
公开(公告)号： US20080197461A1公开(公告)日： 2008-08-21
- 发明人: Chen-Hua Yu , Hui-Lin Chang , Yung-Cheng Lu , Mirng-Ji Lii , Yung-Ching Chen
- 申请人： Chen-Hua Yu , Hui-Lin Chang , Yung-Cheng Lu , Mirng-Ji Lii , Yung-Ching Chen
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING CO.,LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING CO.,LTD.
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; B23K37/00 ; H01L23/495
摘要：
An apparatus for wire bonding and a capillary tool thereof are provided. An exemplary embodiment of a capillary tool capable of a wire bonding comprises a body having a first internal channel of a first diameter for accommodating a flow of a conductive wire. A compressible head is connected to the body, having a second internal channel of a second diameter for accommodating the flow of the conductive wire, wherein the first diameter is fixed and the second diameter is variable, the second diameter is not more than the first diameter and a diameter the conductive wire flowed through the compressible head is adjustable. An integrated circuit (IC) package is also provided.