发明申请
US20080217684A1 Semiconductor device and manufacturing method thereof and power supply apparatus using the same
审中-公开
半导体装置及其制造方法以及使用其的电源装置
- 专利标题: Semiconductor device and manufacturing method thereof and power supply apparatus using the same
- 专利标题(中): 半导体装置及其制造方法以及使用其的电源装置
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申请号: US12011286申请日: 2008-01-25
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公开(公告)号: US20080217684A1公开(公告)日: 2008-09-11
- 发明人: Takayuki Hashimoto , Takashi Hirao , Masaki Shiraishi
- 申请人: Takayuki Hashimoto , Takashi Hirao , Masaki Shiraishi
- 申请人地址: JP Tokyo
- 专利权人: Renesas Technology Corp.
- 当前专利权人: Renesas Technology Corp.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2007-054156 20070305
- 主分类号: H01L27/088
- IPC分类号: H01L27/088 ; H01L29/78 ; H01L21/336
摘要:
A semiconductor device comprises a trench-gate type field-effect transistor on a semiconductor substrate having a first main surface and a second main surface oppositely positioned in a thickness direction, wherein the trench-gate type field-effect transistor comprises a first semiconductor region at the first main surface side; a second semiconductor region at the second main surface; a semiconductor well region between the first semiconductor region and the second semiconductor region; a trench formed so as to protrude in a first direction intersecting the second main surface; a gate electrode formed on an inner surface of the trench via a gate insulating film, and a bottom of the gate electrode is in the first semiconductor region, and a well bottom has a well deep portion and a well shallow portion, and the well deep portion is in a region more distant from the gate insulating film compared to the well shallow portion.
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