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发明申请
US20080220549A1 Sealed light emitting diode assemblies including annular gaskets and methods of making same 失效
密封发光二极管组件，包括环形垫片及其制造方法

Sealed light emitting diode assemblies including annular gaskets and methods of making same
摘要：
An optoelectronic device assembly includes a circuit board and an optoelectronic device disposed on the circuit board and electrically connected with the circuit board. An annular gasket is disposed on the circuit board and surrounds the optoelectronic device. A sealant is disposed over and seals at least a portion of the circuit board and also covers at least an outer annular portion of the annular gasket. The sealant is not disposed over the optoelectronic device. In a method, an optoelectronic device is disposed on a circuit board, the disposing including electrically connecting the optoelectronic device with the circuit board. An annular gasket is disposed on the circuit board to surround the optoelectronic device. The circuit board is sealed with a sealant that also covers at least an outer annular portion of the annular gasket, but does not cover the optoelectronic device.
摘要（中）：

光电子器件组件包括电路板和设置在电路板上并与电路板电连接的光电器件。 环形垫片设置在电路板上并围绕光电器件。 将密封剂设置在并且密封电路板的至少一部分并且还覆盖环形垫圈的至少外部环形部分。 密封剂未设置在光电子器件上。 在一种方法中，光电子器件设置在电路板上，该布置包括将光电器件与电路板电连接。 环形垫圈设置在电路板上以围绕光电子器件。 电路板用密封剂密封，密封剂还覆盖环形垫片的至少外环形部分，但不覆盖光电子器件。

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