公开(公告)号：US07633055B2

公开(公告)日：2009-12-15

申请号：US11715746

申请日：2007-03-08

申请人： Jeffrey Nall ,  Babi Koushik Saha ,  Bill Xin Wang

发明人： Jeffrey Nall ,  Babi Koushik Saha ,  Bill Xin Wang

IPC分类号： H01J40/14 ,  H01J5/02

CPC分类号： H05K3/284 ,  F21K9/00 ,  F21V31/005 ,  F21V31/04 ,  F21Y2115/10 ,  H05K2201/0989 ,  H05K2201/10106 ,  H05K2201/2018 ,  H05K2203/1316

摘要： An optoelectronic device assembly includes a circuit board and an optoelectronic device disposed on the circuit board and electrically connected with the circuit board. An annular gasket is disposed on the circuit board and surrounds the optoelectronic device. A sealant is disposed over and seals at least a portion of the circuit board and also covers at least an outer annular portion of the annular gasket. The sealant is not disposed over the optoelectronic device. In a method, an optoelectronic device is disposed on a circuit board, the disposing including electrically connecting the optoelectronic device with the circuit board. An annular gasket is disposed on the circuit board to surround the optoelectronic device. The circuit board is sealed with a sealant that also covers at least an outer annular portion of the annular gasket, but does not cover the optoelectronic device.

摘要翻译： 光电子器件组件包括电路板和设置在电路板上并与电路板电连接的光电器件。 环形垫片设置在电路板上并围绕光电器件。 将密封剂设置在并且密封电路板的至少一部分并且还覆盖环形垫圈的至少外部环形部分。 密封剂未设置在光电子器件上。 在一种方法中，光电子器件设置在电路板上，该布置包括将光电器件与电路板电连接。 环形垫圈设置在电路板上以围绕光电子器件。 电路板用密封剂密封，密封剂还覆盖环形垫片的至少外环形部分，但不覆盖光电子器件。

公开(公告)号：US20080220549A1

公开(公告)日：2008-09-11

申请号：US11715746

申请日：2007-03-08

申请人： Jeffrey Nall ,  Babi Koushik Saha ,  Bill Xin Wang

发明人： Jeffrey Nall ,  Babi Koushik Saha ,  Bill Xin Wang

IPC分类号： H01J40/14

CPC分类号： H05K3/284 ,  F21K9/00 ,  F21V31/005 ,  F21V31/04 ,  F21Y2115/10 ,  H05K2201/0989 ,  H05K2201/10106 ,  H05K2201/2018 ,  H05K2203/1316

摘要： An optoelectronic device assembly includes a circuit board and an optoelectronic device disposed on the circuit board and electrically connected with the circuit board. An annular gasket is disposed on the circuit board and surrounds the optoelectronic device. A sealant is disposed over and seals at least a portion of the circuit board and also covers at least an outer annular portion of the annular gasket. The sealant is not disposed over the optoelectronic device. In a method, an optoelectronic device is disposed on a circuit board, the disposing including electrically connecting the optoelectronic device with the circuit board. An annular gasket is disposed on the circuit board to surround the optoelectronic device. The circuit board is sealed with a sealant that also covers at least an outer annular portion of the annular gasket, but does not cover the optoelectronic device.

摘要翻译： 光电子器件组件包括电路板和设置在电路板上并与电路板电连接的光电器件。 环形垫片设置在电路板上并围绕光电器件。 将密封剂设置在并且密封电路板的至少一部分并且还覆盖环形垫圈的至少外部环形部分。 密封剂未设置在光电子器件上。 在一种方法中，光电子器件设置在电路板上，该布置包括将光电器件与电路板电连接。 环形垫圈设置在电路板上以围绕光电子器件。 电路板用密封剂密封，密封剂还覆盖环形垫片的至少外环形部分，但不覆盖光电子器件。

公开(公告)号：US20080232105A1

公开(公告)日：2008-09-25

申请号：US11821683

申请日：2007-06-25

申请人： Babi Koushik Saha ,  Jeffrey Nall ,  Chunmei Gao

发明人： Babi Koushik Saha ,  Jeffrey Nall ,  Chunmei Gao

IPC分类号： F21V31/00 ,  H01J9/26

CPC分类号： F21V31/00 ,  B29C45/14065 ,  B29C45/14655 ,  B29C45/14836 ,  B29C45/16 ,  B29C45/2628 ,  B29C2045/14844 ,  B29K2995/0025 ,  B29K2995/0026 ,  B29L2031/747 ,  F21S4/20 ,  F21V15/01 ,  F21V21/002 ,  F21V21/0808 ,  F21Y2115/10 ,  G09F9/33 ,  G09F13/22

摘要： A method of manufacturing a lighting module comprises: mounting one or more light emitting diode (LED) packages on a circuit board to define a lighting unit; and injection overmolding the entire lighting unit except the one or more LED packages using a single type of overmolding material. A lighting module comprises: one or more LED packages mounted on a circuit board; and an injection overmolding sealing the circuit board, the injection overmolding not having openings corresponding to piece holding pins, the injection overmolding not covering at least a light emitting portion of the one or more LED packages.

摘要翻译： 制造照明模块的方法包括：在电路板上安装一个或多个发光二极管（LED）封装以限定照明单元; 并且使用单一类型的包覆成型材料注射除了一个或多个LED封装之外的整个照明单元。 照明模块包括：安装在电路板上的一个或多个LED封装; 以及密封所述电路板的注射成型，所述注射包覆成型不具有对应于片保持销的开口，所述注射包覆成型不覆盖所述一个或多个LED封装的至少一个发光部分。

公开(公告)号：US20080232103A1

公开(公告)日：2008-09-25

申请号：US11725359

申请日：2007-03-19

申请人： Jeffrey Nall ,  Tomislav Stimac ,  Chenyang Li ,  Chunmei Gao ,  Babi Koushik Saha ,  Shanshan Xie ,  Douglas R. Halley

发明人： Jeffrey Nall ,  Tomislav Stimac ,  Chenyang Li ,  Chunmei Gao ,  Babi Koushik Saha ,  Shanshan Xie ,  Douglas R. Halley

IPC分类号： F21V21/00

CPC分类号： F21V21/002 ,  F21S4/10 ,  F21W2111/02 ,  F21W2111/023 ,  F21Y2115/10 ,  G09F9/33

摘要： A flexible lighting strip includes an insulated flexible electrical power cord and spaced apart modules connected therewith. Each module includes a circuit board with a cavity, indentation, or opening and an encasing overmolding defining a fastener-receiving slot or opening aligned with the cavity, indentation, or opening of the circuit board. Power cord conductors are separated at the connection with each module to define a gap receiving a portion of the circuit board. A separate tiedown is secured to the power cord. Conductive elements receiving electrical power from the power cord and delivering electrical power to the circuit board include an insulation-displacing portion and a recess receiving at least a portion of the power cord and including a retaining barb or hook. An adhesive tape or strip is disposed over at least one overmolding opening to prevent water ingress to the circuit board.

摘要翻译： 柔性照明条包括绝缘的柔性电源线和与之连接的间隔开的模块。 每个模块包括具有空腔，凹口或开口的电路板，以及包围模制，其限定与电路板的空腔，凹口或开口对准的紧固件接收槽或开口。 电源线导体在与每个模块的连接处分开，以限定接收电路板的一部分的间隙。 电源线固定在一个单独的连接器上。 从电源线接收电力并向电路板输送电力的导电元件包括​​绝缘位移部分和容纳电源线的至少一部分并包括保持倒钩或钩的凹部。 胶带或条带设置在至少一个包覆成型开口上，以防止水侵入电路板。

公开(公告)号：US07931386B2

公开(公告)日：2011-04-26

申请号：US11725359

申请日：2007-03-19

申请人： Jeffrey Nall ,  Tomislav Stimac ,  Chenyang Li ,  Chunmei Gao ,  Babi Koushik Saha ,  Shanshan Xie ,  Douglas R. Halley

发明人： Jeffrey Nall ,  Tomislav Stimac ,  Chenyang Li ,  Chunmei Gao ,  Babi Koushik Saha ,  Shanshan Xie ,  Douglas R. Halley

IPC分类号： F21S4/00 ,  F21V27/00 ,  H01R33/76

CPC分类号： F21V21/002 ,  F21S4/10 ,  F21W2111/02 ,  F21W2111/023 ,  F21Y2115/10 ,  G09F9/33

摘要： A flexible lighting strip includes an insulated flexible electrical power cord and spaced apart modules connected therewith. Each module includes a circuit board with a cavity, indentation, or opening and an encasing overmolding defining a fastener-receiving slot or opening aligned with the cavity, indentation, or opening of the circuit board. Power cord conductors are separated at the connection with each module to define a gap receiving a portion of the circuit board. A separate tiedown is secured to the power cord. Conductive elements receiving electrical power from the power cord and delivering electrical power to the circuit board include an insulation-displacing portion and a recess receiving at least a portion of the power cord and including a retaining barb or hook. An adhesive tape or strip is disposed over at least one overmolding opening to prevent water ingress to the circuit board.

摘要翻译： 柔性照明条包括绝缘的柔性电源线和与之连接的间隔开的模块。 每个模块包括具有空腔，凹口或开口的电路板，以及包围模制，其限定与电路板的空腔，凹口或开口对准的紧固件接收槽或开口。 电源线导体在与每个模块的连接处分开，以限定接收电路板的一部分的间隙。 电源线固定在一个单独的连接器上。 从电源线接收电力并向电路板输送电力的导电元件包括​​绝缘位移部分和容纳电源线的至少一部分并包括保持倒钩或钩的凹部。 胶带或条带设置在至少一个包覆成型开口上，以防止水侵入电路板。

公开(公告)号：US07687288B2

公开(公告)日：2010-03-30

申请号：US11821683

申请日：2007-06-25

申请人： Babi Koushik Saha ,  Jeffrey Nall ,  Chunmei Gao

发明人： Babi Koushik Saha ,  Jeffrey Nall ,  Chunmei Gao

IPC分类号： H01L21/00

CPC分类号： F21V31/00 ,  B29C45/14065 ,  B29C45/14655 ,  B29C45/14836 ,  B29C45/16 ,  B29C45/2628 ,  B29C2045/14844 ,  B29K2995/0025 ,  B29K2995/0026 ,  B29L2031/747 ,  F21S4/20 ,  F21V15/01 ,  F21V21/002 ,  F21V21/0808 ,  F21Y2115/10 ,  G09F9/33 ,  G09F13/22

摘要： A method of manufacturing a lighting module comprises: mounting one or more light emitting diode (LED) packages on a circuit board to define a lighting unit; and injection overmolding the entire lighting unit except the one or more LED packages using a single type of overmolding material. A lighting module comprises: one or more LED packages mounted on a circuit board; and an injection overmolding sealing the circuit board, the injection overmolding not having openings corresponding to piece holding pins, the injection overmolding not covering at least a light emitting portion of the one or more LED packages.

摘要翻译： 制造照明模块的方法包括：在电路板上安装一个或多个发光二极管（LED）封装以限定照明单元; 并且使用单一类型的包覆成型材料注射除了一个或多个LED封装之外的整个照明单元。 照明模块包括：安装在电路板上的一个或多个LED封装; 以及密封所述电路板的注射成型，所述注射包覆成型不具有对应于片保持销的开口，所述注射包覆成型不覆盖所述一个或多个LED封装的至少一个发光部分。

公开(公告)号：US20140153244A1

公开(公告)日：2014-06-05

申请号：US13929965

申请日：2013-06-28

申请人： Bill (Xin) Wang ,  Jeffrey Nall ,  Luc Cloutier ,  John Owens ,  Min Zhang ,  Tyler John Rolfes ,  Adrian Slattery

发明人： Bill (Xin) Wang ,  Jeffrey Nall ,  Luc Cloutier ,  John Owens ,  Min Zhang ,  Tyler John Rolfes ,  Adrian Slattery

IPC分类号： F21K99/00

CPC分类号： F21K9/175 ,  F21K9/27 ,  F21K9/90 ,  G09F13/22 ,  G09F2013/1895 ,  Y10T29/49826

摘要： In accordance with a first exemplary embodiment of the present disclosure, a mounting arrangement for use with an LED power strip module is provided. The mounting arrangement comprises one or more one frames having a first end and a second end, a first holding base configured to mate with the first end and a second holding base configured to mate with the second end, and at least one LED module having a first and second edge and comprising a plurality of LEDs, said LED module being adapted to removably attach to the one or more frames. The first and second holding bases are adapted to secure the one or more frames to an existing raceway structure.

摘要翻译： 根据本公开的第一示例性实施例，提供了一种与LED电源板模块一起使用的安装装置。 所述安装装置包括具有第一端和第二端的一个或多个框架，被配置为与所述第一端部配合的第一保持基座和被配置为与所述第二端部配合的第二保持基座，以及至少一个LED模块， 第一和第二边缘并且包括多个LED，所述LED模块适于可移除地附接到所述一个或多个框架。 第一和第二保持基座适于将一个或多个框架固定到现有的滚道结构。

公开(公告)号：US08474998B2

公开(公告)日：2013-07-02

申请号：US13043023

申请日：2011-03-08

申请人： Bill (Xin) Wang ,  Jeffrey Nall ,  Luc Cloutier ,  John Owens ,  Min Zhang ,  Tyler John Rolfes ,  Adrian Slattery

发明人： Bill (Xin) Wang ,  Jeffrey Nall ,  Luc Cloutier ,  John Owens ,  Min Zhang ,  Tyler John Rolfes ,  Adrian Slattery

IPC分类号： F21S4/00

CPC分类号： F21K9/175 ,  F21K9/27 ,  F21K9/90 ,  G09F13/22 ,  G09F2013/1895 ,  Y10T29/49826

摘要： In accordance with a first exemplary embodiment of the present disclosure, a mounting arrangement for use with an LED power strip module is provided. The mounting arrangement comprises one or more one frames having a first end and a second end, a first holding base configured to mate with the first end and a second holding base configured to mate with the second end, and at least one LED module having a first and second edge and comprising a plurality of LEDs, said LED module being adapted to removably attach to the one or more frames. The first and second holding bases are adapted to secure the one or more frames to an existing raceway structure.

公开(公告)号：US20120002418A1

公开(公告)日：2012-01-05

申请号：US13043023

申请日：2011-03-08

申请人： Bill (Xin) Wang ,  Jeffrey Nall ,  Luc Cloutier ,  John Owens ,  Min Zhang ,  Tyler John Rolfes ,  Adrian Slattery

发明人： Bill (Xin) Wang ,  Jeffrey Nall ,  Luc Cloutier ,  John Owens ,  Min Zhang ,  Tyler John Rolfes ,  Adrian Slattery

IPC分类号： F21S4/00

CPC分类号： F21K9/175 ,  F21K9/27 ,  F21K9/90 ,  G09F13/22 ,  G09F2013/1895 ,  Y10T29/49826

摘要： In accordance with a first exemplary embodiment of the present disclosure, a mounting arrangement for use with an LED power strip module is provided. The mounting arrangement comprises one or more one frames having a first end and a second end, a first holding base configured to mate with the first end and a second holding base configured to mate with the second end, and at least one LED module having a first and second edge and comprising a plurality of LEDs, said LED module being adapted to removably attach to the one or more frames. The first and second holding bases are adapted to secure the one or more frames to an existing raceway structure.

摘要翻译： 根据本公开的第一示例性实施例，提供了一种与LED电源板模块一起使用的安装装置。 所述安装装置包括具有第一端和第二端的一个或多个框架，被配置为与所述第一端部配合的第一保持基座和被配置为与所述第二端部配合的第二保持基座，以及至少一个LED模块， 第一和第二边缘并且包括多个LED，所述LED模块适于可移除地附接到所述一个或多个框架。 第一和第二保持基座适于将一个或多个框架固定到现有的滚道结构。

公开(公告)号：US10244616B2

公开(公告)日：2019-03-26

申请号：US15164054

申请日：2016-05-25

申请人： Jeffrey Nall ,  Matthew Mrakovich

发明人： Jeffrey Nall ,  Matthew Mrakovich

IPC分类号： F21V3/00 ,  F21V5/00 ,  H05K1/02 ,  F21V9/30 ,  F21V3/10 ,  F21V29/00 ,  G09F9/33 ,  H05K3/28 ,  F21V23/00 ,  F21V29/70 ,  F21V29/85 ,  F21V23/02 ,  F21S4/10 ,  F21S4/20 ,  F21K9/90 ,  F21V3/02 ,  H05K1/18 ,  H05K3/32 ,  F21V3/12 ,  F21V31/04 ,  F21V3/04 ,  F21Y101/00 ,  F21Y115/10

摘要： One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.