发明申请
US20080230877A1 SEMICONDUCTOR PACKAGE HAVING WIRE REDISTRIBUTION LAYER AND METHOD OF FABRICATING THE SAME
审中-公开
具有电线重分配层的半导体封装及其制造方法
- 专利标题： SEMICONDUCTOR PACKAGE HAVING WIRE REDISTRIBUTION LAYER AND METHOD OF FABRICATING THE SAME
- 专利标题（中）： 具有电线重分配层的半导体封装及其制造方法
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申请号： US12050343申请日： 2008-03-18
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公开(公告)号： US20080230877A1公开(公告)日： 2008-09-25
- 发明人: Hyun-soo Chung , Dong-hyeon Jang , Son-kwan Hwang , Nam-seog Kim
- 申请人： Hyun-soo Chung , Dong-hyeon Jang , Son-kwan Hwang , Nam-seog Kim
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 优先权： KR10-2007-0026806 20070319
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/768
摘要：
A semiconductor package and a method of fabricating the same. The method includes providing a semiconductor substrate on which a chip pad is formed. A wire redistribution layer connected to the chip pad is formed. An insulating layer which includes an opening exposing a portion of the wire redistribution layer is formed. A metal ink is applied within the opening to thereby form a bonding pad. The applied metal ink within the opening and the insulating layer can be cured simultaneously.
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