发明申请
- 专利标题： THERMALLY CONDUCTIVE SHEET AND SUBSTRATE MOUNTING DEVICE INCLUDING SAME
- 专利标题（中）： 导热片和基板安装装置，包括相同的
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申请号： US12055633申请日： 2008-03-26
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公开(公告)号： US20080239691A1公开(公告)日： 2008-10-02
- 发明人: Masaaki MIYAGAWA , Akihiro YOSHIMURA
- 申请人： Masaaki MIYAGAWA , Akihiro YOSHIMURA
- 申请人地址： JP Tokyo
- 专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人地址： JP Tokyo
- 优先权： JP2007-081747 20070327
- 主分类号： H05K7/02
- IPC分类号： H05K7/02 ; F28F7/00
摘要：
A thermally conductive sheet is used between a mounting table for mounting thereon a target substrate and an annular focus ring mounted on the mounting table to surround a circumferential peripheral portion of the target substrate. Further, the mounting table includes therein a cooling unit and is disposed in a depressurized accommodating chamber for accommodating therein the target substrate. The thermally conductive sheet has a non-adhesive layer on each of one or more surfaces thereof.
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