发明申请
- 专利标题： THERMAL INTERFACE MATERIAL AND METHOD FOR FABRICATING THE SAME
- 专利标题（中）： 热界面材料及其制造方法
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申请号： US11959144申请日： 2007-12-18
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公开(公告)号： US20080241545A1公开(公告)日： 2008-10-02
- 发明人: DING WANG , CHANG-HONG LIU , PENG-CHENG SONG , SHOU-SHAN FAN
- 申请人： DING WANG , CHANG-HONG LIU , PENG-CHENG SONG , SHOU-SHAN FAN
- 申请人地址： CN Beijing TW Tu-Cheng
- 专利权人： TSINGHUA UNIVERSITY,HON HAI PRECISION INDUSTRY CO., LTD.
- 当前专利权人： TSINGHUA UNIVERSITY,HON HAI PRECISION INDUSTRY CO., LTD.
- 当前专利权人地址： CN Beijing TW Tu-Cheng
- 优先权： CN200710073770.9 20070330
- 主分类号： B32B9/00
- IPC分类号： B32B9/00 ; B05D5/12
摘要：
A thermal interface material includes an array of carbon nanotubes with interspaces defined therebetween; and a low melting point metallic material filled in the interspaces. A method for fabricating a thermal interface material, the method includes (a) providing an array of carbon nanotubes with interspaces defined therebetween; and (b) depositing a low melting point metallic material on the carbon nanotubes in the interspaces therebetween to form a metallic layer with the array of carbon nanotubes embedded therein, and thereby, achieving the thermal interface material.