发明申请
- 专利标题： Method and system for thermally processing a plurality of wafer-shaped objects
- 专利标题（中）： 用于热处理多个晶片形物体的方法和系统
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申请号： US11784503申请日： 2007-04-06
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公开(公告)号： US20080248657A1公开(公告)日： 2008-10-09
- 发明人: Zsolt Nenyei , Paul J. Timans , Wilfried Lerch , Juergen Niess , Manfred Falter , Patrick Schmid , Conor Patrick O'Carroll , Rudy Cardema , Igor Fidelman , Sing-Pin Tay , Yao Zhi Hu , Daniel J. Devine
- 申请人： Zsolt Nenyei , Paul J. Timans , Wilfried Lerch , Juergen Niess , Manfred Falter , Patrick Schmid , Conor Patrick O'Carroll , Rudy Cardema , Igor Fidelman , Sing-Pin Tay , Yao Zhi Hu , Daniel J. Devine
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
Process and system for processing wafer-shaped objects, such as semiconductor wafers is disclosed. In accordance with the present disclosure, a multiple of two wafers are processed in a thermal processing chamber. The thermal processing chamber is in communication with at least one heating device for heating the wafers. The wafers are placed in the thermal processing chamber in a face-to-face configuration or in a back-to-back configuration.