Invention Application
- Patent Title: Optical module device
- Patent Title (中): 光模块设备
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Application No.: US12068896Application Date: 2008-02-13
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Publication No.: US20080253720A1Publication Date: 2008-10-16
- Inventor: Takahiro Yamaguchi , Yoshihiko Kobayashi , Tsutomu Nakamura
- Applicant: Takahiro Yamaguchi , Yoshihiko Kobayashi , Tsutomu Nakamura
- Assignee: Oki Electric Industry Co., Ltd.
- Current Assignee: Oki Electric Industry Co., Ltd.
- Priority: JP2007-105857 20070413
- Main IPC: G02B6/26
- IPC: G02B6/26

Abstract:
An optical module device includes an optical module having leads, a print substrate and a flexible substrate including a first region having a center and a peripheral areas, a second and a third region, the flexible substrate including first through-holes corresponding to the leads in the center area, a terminal and a metalized trace formed in the second and third regions respectively, and a protection layer formed on its surface at the peripheral area and in the third region, wherein the flexible substrate further includes two second through-holes in the peripheral area, which is a location close to the third region, wherein the flexible substrate is bent along a line coupling the two second through-holes, and wherein the flexible substrate at it first region is fixed to the second end member by adhesive material injected into the second through-holes.
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