发明申请
- 专利标题: Microphotonic waveguide including core/cladding interface layer
- 专利标题(中): 微波导管包括芯/包层界面层
-
申请号: US11899234申请日: 2007-09-05
-
公开(公告)号: US20080253728A1公开(公告)日: 2008-10-16
- 发明人: Daniel K. Sparacin , Anuradha M. Agarwal , Pradip K. Roy , Lionel C. Kimerling
- 申请人: Daniel K. Sparacin , Anuradha M. Agarwal , Pradip K. Roy , Lionel C. Kimerling
- 申请人地址: US MA Cambridge
- 专利权人: Massachusetts Institute of Technology
- 当前专利权人: Massachusetts Institute of Technology
- 当前专利权人地址: US MA Cambridge
- 主分类号: G02B6/10
- IPC分类号: G02B6/10 ; C03B37/022
摘要:
The invention provides a waveguide with a waveguide core having longitudinal sidewall surfaces, a longitudinal top surface, and a longitudinal bottom surface that is disposed on a substrate. An interface layer is disposed on at least one longitudinal sidewall surface of the waveguide core. A waveguide cladding layer is disposed on at least the waveguide core sidewall and top surfaces, over the interface layer. The waveguide of the invention can be produced by forming a waveguide undercladding layer on a substrate, and then forming a waveguide core on the undercladding layer. An interface layer is then formed on at least a longitudinal sidewall surface of the waveguide core, and an upper cladding layer is formed on a longitudinal top surface and on longitudinal sidewall surfaces of the waveguide core, over the interface layer.
公开/授权文献
信息查询