A method of manufacturing a substrate formed with a plurality of wiring patterns on a base, includes: a first inspection step of identifying a faulty wiring pattern having electric short circuit or disconnection by performing an electric inspection respectively for the plurality of wiring patterns; a second inspection step of examining a relative position of a defect on the base and at least one of a type and a size of the defect by an optical inspection; a matching step of matching a result of the first inspection step with a result of the second inspection step, and identifying a critical defect having electric short circuit or disconnection; and a third inspection step of examining a relative position in a pixel and an effective range of the critical defect by an optical inspection.