Method of manufacturing substrate, substrate manufacturing system, and method of manufacturing display
    1.
    发明授权
    Method of manufacturing substrate, substrate manufacturing system, and method of manufacturing display 有权
    制造基板的方法,基板制造系统以及制造显示方法

    公开(公告)号:US07824930B2

    公开(公告)日:2010-11-02

    申请号:US12100234

    申请日:2008-04-09

    IPC分类号: H01L21/66

    摘要: A method of manufacturing a substrate formed with a plurality of wiring patterns on a base, includes: a first inspection step of identifying a faulty wiring pattern having electric short circuit or disconnection by performing an electric inspection respectively for the plurality of wiring patterns; a second inspection step of examining a relative position of a defect on the base and at least one of a type and a size of the defect by an optical inspection; a matching step of matching a result of the first inspection step with a result of the second inspection step, and identifying a critical defect having electric short circuit or disconnection; and a third inspection step of examining a relative position in a pixel and an effective range of the critical defect by an optical inspection.

    摘要翻译: 一种制造在基座上形成有多个布线图案的基板的方法,包括:第一检查步骤,通过分别对多个布线图案执行电检查来识别具有电短路或断开的故障布线图案; 第二检查步骤,通过光学检查来检查基底上的缺陷的相对位置和缺陷的类型和尺寸中的至少一个; 将第一检查步骤的结果与第二检查步骤的结果进行匹配的匹配步骤,以及识别具有电短路或断开的临界缺陷; 以及第三检查步骤,通过光学检查来检查像素中的相对位置和临界缺陷的有效范围。

    METHOD OF MANUFACTURING SUBSTRATE, SUBSTRATE MANUFACTURING SYSTEM, AND METHOD OF MANUFACTURING DISPLAY
    2.
    发明申请
    METHOD OF MANUFACTURING SUBSTRATE, SUBSTRATE MANUFACTURING SYSTEM, AND METHOD OF MANUFACTURING DISPLAY 有权
    制造基板的方法,基板制造系统及其制造方法

    公开(公告)号:US20080254701A1

    公开(公告)日:2008-10-16

    申请号:US12100234

    申请日:2008-04-09

    IPC分类号: H01J9/50

    摘要: A method of manufacturing a substrate formed with a plurality of wiring patterns on a base, includes: a first inspection step of identifying a faulty wiring pattern having electric short circuit or disconnection by performing an electric inspection respectively for the plurality of wiring patterns; a second inspection step of examining a relative position of a defect on the base and at least one of a type and a size of the defect by an optical inspection; a matching step of matching a result of the first inspection step with a result of the second inspection step, and identifying a critical defect having electric short circuit or disconnection; and a third inspection step of examining a relative position in a pixel and an effective range of the critical defect by an optical inspection.

    摘要翻译: 一种制造在基座上形成有多个布线图案的基板的方法,包括:第一检查步骤,通过分别对多个布线图案执行电检查来识别具有电短路或断开的故障布线图案; 第二检查步骤,通过光学检查来检查基底上的缺陷的相对位置和缺陷的类型和尺寸中的至少一个; 将第一检查步骤的结果与第二检查步骤的结果进行匹配的匹配步骤,以及识别具有电短路或断开的临界缺陷; 以及第三检查步骤,通过光学检查来检查像素中的相对位置和临界缺陷的有效范围。

    DEFECT REPAIR APPARATUS AND DEFECT REPAIR METHOD
    3.
    发明申请
    DEFECT REPAIR APPARATUS AND DEFECT REPAIR METHOD 失效
    缺陷修复装置和缺陷修复方法

    公开(公告)号:US20100100356A1

    公开(公告)日:2010-04-22

    申请号:US12603076

    申请日:2009-10-21

    申请人: Akiko Tsutsui

    发明人: Akiko Tsutsui

    IPC分类号: H01J9/50 G06F11/30

    摘要: A defect repair apparatus includes a defect detection unit, a database, a defect repair unit, and a control unit. The defect detection unit inspects a multilayer substrate on which a repetitive pattern is formed and extracts positional information on a defect in the repetitive pattern and feature information on the defect. In the database, a plurality of defect repair techniques are registered. The defect repair unit repairs the defect of the multilayer substrate by a defect repair technique specified. The control unit reads a defect repair technique for the defect detected by the defect detection unit and controls the defect repair unit that repairs the defect by using the defect repair technique.

    摘要翻译: 缺陷修复装置包括缺陷检测单元,数据库,缺陷修复单元和控制单元。 缺陷检测单元检查其上形成有重复图案的多层基板,并提取关于重复图案的缺陷的位置信息和关于缺陷的特征信息。 在数据库中,登记了多种缺陷修复技术。 缺陷修复单元通过指定的缺陷修复技术修复多层基板的缺陷。 控制单元读取由缺陷检测单元检测到的缺陷的缺陷修复技术,并且通过使用缺陷修复技术来控制修复缺陷的缺陷修复单元。

    Defect repair apparatus and defect repair method
    4.
    发明授权
    Defect repair apparatus and defect repair method 失效
    缺陷修复装置和缺陷修复方法

    公开(公告)号:US08311775B2

    公开(公告)日:2012-11-13

    申请号:US12603076

    申请日:2009-10-21

    申请人: Akiko Tsutsui

    发明人: Akiko Tsutsui

    IPC分类号: G06F11/30

    摘要: A defect repair apparatus includes a defect detection unit, a database, a defect repair unit, and a control unit. The defect detection unit inspects a multilayer substrate on which a repetitive pattern is formed and extracts positional information on a defect in the repetitive pattern and feature information on the defect. In the database, a plurality of defect repair techniques are registered. The defect repair unit repairs the defect of the multilayer substrate by a defect repair technique specified. The control unit reads a defect repair technique for the defect detected by the defect detection unit and controls the defect repair unit that repairs the defect by using the defect repair technique.

    摘要翻译: 缺陷修复装置包括缺陷检测单元,数据库,缺陷修复单元和控制单元。 缺陷检测单元检查其上形成有重复图案的多层基板,并提取关于重复图案的缺陷的位置信息和关于缺陷的特征信息。 在数据库中,登记了多种缺陷修复技术。 缺陷修复单元通过指定的缺陷修复技术修复多层基板的缺陷。 控制单元读取由缺陷检测单元检测到的缺陷的缺陷修复技术,并且通过使用缺陷修复技术来控制修复缺陷的缺陷修复单元。