Invention Application
US20080255283A1 THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE 审中-公开
热固性环氧树脂组合物和半导体器件

THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
Abstract:
A thermosetting epoxy resin composition is provided comprising (A) a reaction product obtained through reaction of a triazine derived epoxy resin with an acid anhydride, (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst. In one embodiment, (B) an internal parting agent having a melting point of 50-90° C. is included. In another embodiment, (I) inorganic whisker fibers having an average fineness of 0.05-50 μm and an average length of 1.0-1,000 μm are included.
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