Invention Application
US20080255283A1 THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
审中-公开
热固性环氧树脂组合物和半导体器件
- Patent Title: THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- Patent Title (中): 热固性环氧树脂组合物和半导体器件
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Application No.: US12026433Application Date: 2008-02-05
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Publication No.: US20080255283A1Publication Date: 2008-10-16
- Inventor: Takayuki Aoki , Tadaharu Ikeda
- Applicant: Takayuki Aoki , Tadaharu Ikeda
- Priority: JP2007-026508 20070206; JP2007-026659 20070206
- Main IPC: C08K3/36
- IPC: C08K3/36 ; C08K5/05 ; H01L23/29 ; C08K5/06

Abstract:
A thermosetting epoxy resin composition is provided comprising (A) a reaction product obtained through reaction of a triazine derived epoxy resin with an acid anhydride, (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst. In one embodiment, (B) an internal parting agent having a melting point of 50-90° C. is included. In another embodiment, (I) inorganic whisker fibers having an average fineness of 0.05-50 μm and an average length of 1.0-1,000 μm are included.
Information query